AP7175

Document number: DS35606 Rev. 4 - 3

5 of 14

www.diodes.com

January 2017

© Diodes Incorporated

AP7175

NOT RECOMMENDED FOR NEW DESIGN -

NO ALTERNATE PART

Symbol

Parameter

Test Conditions

AP7175

Unit

Min

Typ

Max

THERMAL CHARACTERISTIC

Thermal Resistance Junction-to-Ambient

SO-8EP (Note 6)

—

70

—

C/W

MSOP-8EP (Note 7)

—

80

—

C/W

Thermal Resistance Junction-to-Case

SO-8EP (Note 6)

—

30

—

C/W

MSOP-8EP (Note 7)

—

30

—

C/W

Notes:

6. Device mounted on 2"*2" FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground

plane.

7. Device mounted on 2"*2" FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.

Typical Characteristics