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SN65HVD3082E Datasheet(PDF) 2 Page - Texas Instruments

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Part # SN65HVD3082E
Description  Low-Power RS-485 Transceivers, Available in a Small MSOP-8 Package
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

SN65HVD3082E Datasheet(HTML) 2 Page - Texas Instruments

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SN65HVD3082E, SN75HVD3082E, SN65HVD3085E, SN65HVD3088E
SLLS562I – AUGUST 2009 – REVISED SEPTEMBER 2016
www.ti.com
Product Folder Links: SN65HVD3082E SN75HVD3082E SN65HVD3085E SN65HVD3088E
Submit Documentation Feedback
Copyright © 2009–2016, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Pin Configuration and Functions ......................... 3
6
Specifications......................................................... 3
6.1
Absolute Maximum Ratings ...................................... 3
6.2
ESD Ratings.............................................................. 3
6.3
Recommended Operating Conditions ....................... 4
6.4
Thermal Information ................................................. 4
6.5
Electrical Characteristics: Driver ............................... 5
6.6
Electrical Characteristics: Receiver ......................... 5
6.7
Power Characteristics ............................................... 6
6.8
Switching Characteristics: Driver .............................. 6
6.9
Switching Characteristics: Receiver.......................... 7
6.10
Typical Characteristics ............................................ 8
7
Parameter Measurement Information ................ 10
8
Detailed Description ............................................ 15
8.1
Overview ................................................................. 15
8.2
Functional Block Diagram ....................................... 15
8.3
Feature Description................................................. 15
8.4
Device Functional Modes........................................ 15
9
Application and Implementation ........................ 17
9.1
Application Information............................................ 17
9.2
Typical Application ................................................. 17
10
Power Supply Recommendations ..................... 21
11
Layout................................................................... 21
11.1
Layout Guidelines ................................................. 21
11.2
Layout Example .................................................... 21
11.3
Thermal Considerations for IC Packages ............. 22
12
Device and Documentation Support ................. 23
12.1
Device Support...................................................... 23
12.2
Related Links ........................................................ 23
12.3
Receiving Notification of Documentation Updates 23
12.4
Community Resources.......................................... 23
12.5
Trademarks ........................................................... 23
12.6
Electrostatic Discharge Caution ............................ 23
12.7
Glossary ................................................................ 23
13
Mechanical, Packaging, and Orderable
Information ........................................................... 24
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision H (August 2015) to Revision I
Page
Added text to the Description, "The D package version of the SN65HVD3082E has been characterized for operation
from -40°C to 105°C."............................................................................................................................................................. 1
Changed the Operating free-air temperature for SN65HVD3082E (D package) From: MAX = 85°C To: 105°C in
Recommended Operating Conditions ................................................................................................................................... 4
Changes from Revision G (May 2009) to Revision H
Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Deleted Dissipation Ratings table .......................................................................................................................................... 1
Added storage temperature Tstg to Absolute Maximum Ratings table ................................................................................... 3
Deleted Package Thermal Information table ......................................................................................................................... 6
Changes from Revision F (March 2009) to Revision G
Page
Added Graph - Driver Rise and Fall Time vs Temperature.................................................................................................... 8
Added IDLE Bus to the Function Table ................................................................................................................................ 15
Added Receiver Failsafe section .......................................................................................................................................... 19


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