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SN65LBC184P Datasheet(PDF) 3 Page - Texas Instruments |
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SN65LBC184P Datasheet(HTML) 3 Page - Texas Instruments |
3 / 27 page SN65LBC184, SN75LBC184 www.ti.com SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 5 Pin Configuration and Functions D Package, P Package 8-Pin SOIC, 8-Pin PDIP Top View Pin Functions PIN I/O DESCRIPTION NAME NO. A 6 Bus input/output Driver output or receiver input (complementary to B) B 7 Bus input/output Driver output or receiver input (complementary to A) D 4 Digital input Driver data input DE 3 Digital input Active-HIGH driver enable GND 5 Reference potential Local device ground R 1 Digital output Receiver data output RE 2 Digital input Active-LOW receiver enable VCC 8 Supply 4.75-V to 5.25-V supply 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage(2) –0.5 7 V Continuous voltage range at any bus terminal –15 15 V Data input/output voltage –0.3 7 V IO Receiver output current –20 20 mA Continuous total power dissipation(3) Internally Limited Tstg Storage temperature 160 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential input/output bus voltage, are with respect to network ground terminal. (3) The driver shuts down at a junction temperature of approximately 160°C. To operate below this temperature, see the Dissipation Ratings. 6.2 ESD Ratings VALUE UNIT A, B, GND ±15000 Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) All pins ±3000 Contact discharge (IEC61000-4-2) A, B, GND(2) ±30000 Electrostatic V(ESD) V discharge Air discharge (IEC61000-4-2) A, B, GND(3) ±15000 All pins (Class 3A) ±8000 All pins (Class 3B) ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) GND and bus pin ESD protection is beyond readily available test equipment capabilities for IEC 61000-4-2, EIA/JEDEC test method A114-A and MIL-STD-883C method 3015. Ratings listed are limits of test equipment; device performance exceeds these limits. Copyright © 1996–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: SN65LBC184 SN75LBC184 |
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