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BQ24725ARGRR Datasheet(PDF) 4 Page - Texas Instruments |
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BQ24725ARGRR Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 47 page  bq24725A SLUSAL0A – SEPTEMBER 2011 – REVISED AUGUST 2014 www.ti.com Pin Functions (continued) PIN DESCRIPTION NO. NAME 12 SRN Charge current sense resistor negative input. SRN pin is for battery voltage sensing as well. Connect SRN pin to a 7.5 Ω resistor first then from resistor another terminal connect a 0.1µF ceramic capacitor to GND for common-mode filtering and connect to current sensing resistor. Connect a 0.1µF ceramic capacitor between current sensing resistor to provide differential mode filtering. See application information about negative output voltage protection for hard shorts on battery to ground or battery reverse connection by adding small resistor. 13 SRP Charge current sense resistor positive input. Connect SRP pin to a 10 Ω resistor first then from resistor another terminal connect to current sensing resistor. Connect a 0.1µF ceramic capacitor between current sensing resistor to provide differential mode filtering. See application information about negative output voltage protection for hard shorts on battery to ground or battery reverse connection by adding small resistor. 14 GND IC ground. On PCB layout, connect to analog ground plane, and only connect to power ground plane through the power pad underneath IC. 15 LODRV Low side power MOSFET driver output. Connect to low side n-channel MOSFET gate. 16 REGN Linear regulator output. REGN is the output of the 6V linear regulator supplied from VCC. The LDO is active when voltage on ACDET pin is above 0.6V and voltage on VCC is above UVLO. Connect a 1µF ceramic capacitor from REGN to GND. 17 BTST High side power MOSFET driver power supply. Connect a 0.047µF capacitor from BTST to PHASE, and a bootstrap Schottky diode from REGN to BTST. 18 HIDRV High side power MOSFET driver output. Connect to the high side n-channel MOSFET gate. 19 PHASE High side power MOSFET driver source. Connect to the source of the high side n-channel MOSFET. 20 VCC Input supply, diode OR from adapter or battery voltage. Use 10 Ω resistor and 1µF capacitor to ground as low pass filter to limit inrush current. PowerPAD™ Exposed pad beneath the IC. Analog ground and power ground star-connected only at the PowerPAD plane. Always solder PowerPad to the board, and have vias on the PowerPAD plane connecting to analog ground and power ground planes. It also serves as a thermal pad to dissipate the heat. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) VALUE UNIT MIN MAX SRN, SRP, ACN, ACP, CMSRC, VCC –0.3 30 PHASE –2 30 ACDET, SDA, SCL, LODRV, REGN, IOUT, ILIM, ACOK –0.3 7 Voltage range BTST, HIDRV, ACDRV, BATDRV –0.3 36 V LODRV (2% duty cycle) –4 7 HIDVR (2% duty cycle) –4 36 PHASE (2% duty cycle) –4 30 Maximum difference SRP–SRN, ACP–ACN –0.5 0.5 voltage Junction temperature range, TJ –40 155 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the data book for thermal limitations and considerations of packages. 4 Submit Documentation Feedback Copyright © 2011–2014, Texas Instruments Incorporated Product Folder Links: bq24725A |
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