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TLV4171IDR Datasheet(PDF) 6 Page - Texas Instruments

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Part # TLV4171IDR
Description  36-V, Single-Supply, Low-Power Operational Amplifiers for Cost-Sensitive Systems
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TLV4171IDR Datasheet(HTML) 6 Page - Texas Instruments

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TLV171, TLV2171, TLV4171
SBOS783 – SEPTEMBER 2016
www.ti.com
Product Folder Links: TLV171 TLV2171 TLV4171
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Copyright © 2016, Texas Instruments Incorporated
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information: TLV171
THERMAL METRIC(1)
TLV171
UNIT
D (SOIC)
DBV (SOT-23)
8 PINS
5 PINS
RθJA
Junction-to-ambient thermal resistance
149.5
245.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
97.9
133.9
°C/W
RθJB
Junction-to-board thermal resistance
87.7
83.6
°C/W
ψJT
Junction-to-top characterization parameter
35.5
18.2
°C/W
ψJB
Junction-to-board characterization parameter
89.5
83.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Thermal Information: TLV2171
THERMAL METRIC(1)
TLV2171
UNIT
D (SOIC)
DGK (VSSOP)
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
134.3
175.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
72.1
74.9
°C/W
RθJB
Junction-to-board thermal resistance
60.6
22.2
°C/W
ψJT
Junction-to-top characterization parameter
18.2
1.6
°C/W
ψJB
Junction-to-board characterization parameter
53.8
22.8
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.6 Thermal Information: TLV4171
THERMAL METRIC(1)
TLV4171
UNIT
D (SOIC)
PW (TSSOP)
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
93.2
106.9
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
51.8
24.4
°C/W
RθJB
Junction-to-board thermal resistance
49.4
59.3
°C/W
ψJT
Junction-to-top characterization parameter
13.5
0.6
°C/W
ψJB
Junction-to-board characterization parameter
42.2
54.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
°C/W


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