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LM2595S-ADJ Datasheet(PDF) 4 Page - Texas Instruments |
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LM2595S-ADJ Datasheet(HTML) 4 Page - Texas Instruments |
4 / 43 page 4 LM2595 SNVS122C – MAY 1999 – REVISED MAY 2016 www.ti.com Product Folder Links: LM2595 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. 7 Specifications 7.1 Absolute Maximum Ratings (1) (2) MIN MAX UNIT Maximum supply voltage 45 V ON/OFF pin input voltage –0.3 25 V Feedback pin voltage –0.3 25 V Output voltage to ground (steady-state) –1 V Power dissipation Internally limited Lead temperature KTT package Vapor phase (60 sec) 215 °C Infrared (10 sec) 245 NDH package (soldering, 10 sec) 260 Maximum junction temperature 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V 7.3 Recommended Operating Conditions MIN MAX UNIT Supply voltage 4.5 40 V Temperature range, TJ –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) The package thermal impedance is calculated in accordance to JESD 51-7. (3) Thermal resistances were simulated on a 4-layer, JEDEC board 7.4 Thermal Information THERMAL METRIC(1) LM2595 UNIT KTT (TO-263) NDH (TO-220) 5 PINS 5 PINS RθJA Junction-to-ambient thermal resistance(2)(3) Printed-circuit board with 1-oz copper area of approximately 1 in2 — 50 °C/W Printed-circuit board with 0.5 in2 of 1-oz copper area 50 — Printed-circuit board with 2.5 in2 of 1-oz copper area 30 — Double-sided, printed-circuit board with 3 in2 of 1-oz copper area 20 — RθJC(top) Junction-to-case (top) thermal resistance 2 2 °C/W |
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