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TMS320F28022DAQR Datasheet(PDF) 5 Page - Texas Instruments |
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TMS320F28022DAQR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 138 page 5 TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022 TMS320F28021, TMS320F28020, TMS320F280200 www.ti.com SPRS523K – NOVEMBER 2008 – REVISED JUNE 2016 Submit Documentation Feedback Product Folder Links: TMS320F28027 TMS320F28026 TMS320F28023 TMS320F28022 TMS320F28021 TMS320F28020 TMS320F280200 Revision History Copyright © 2008–2016, Texas Instruments Incorporated 2 Revision History Changes from October 8, 2013 to June 27, 2016 (from J Revision (October 2013) to K Revision) Page • Global: Restructured document. .................................................................................................. 1 • Global: Added ESD Ratings table; Detailed Description section; Device and Documentation Support section; and Mechanical Packaging and Orderable Information section. ............................................................... 1 • Global: Added InstaSPIN-FOC™ devices TMS320F28027F and TMS320F28026F. See Table 3-1. ................... 1 • Global: Removed "Analog MUX" table (this was Table 4-12 in SPRS523J). ............................................... 1 • Global: Removed references to the Reliability Data for TMS320LF24xx and TMS320F28xx Devices Application Report. ................................................................................................................................. 1 • Section 1.1 (Features): Removed "Dynamic PLL Ratio Changes Supported" feature. ..................................... 1 • Device Information: Added table. .................................................................................................. 2 • Table 3-1 (Device Comparison): Changed title from "Hardware Features" to "Device Comparison". .................... 6 • Table 3-1: Added InstaSPIN-FOC devices TMS320F28027F and TMS320F28026F. ..................................... 6 • Table 3-1: Added footnote with reference to a list of InstaSPIN™ Technical Reference Manuals. ....................... 6 • Table 3-1: Removed "Product status" row and associated footnote. ......................................................... 6 • Section 3.1 (Related Products): Added section. ................................................................................. 8 • Section 4.2 (Signal Descriptions): Updated NOTE. ............................................................................ 11 • Table 4-1 (Signal Descriptions): Changed title from "Terminal Functions" to "Signal Descriptions". .................... 11 • Table 4-1: Updated DESCRIPTION of X1, XRS, VREFHI, VREFLO, VDD, and VDDIO. ......................................... 11 • Section 5.1 (Absolute Maximum Ratings): Added Input voltage, VIN (X1). ................................................. 16 • Section 5.3 (Recommended Operating Conditions): Removed "VDDIO and VDDA should be maintained within ~0.3 V of each other" footnote. ......................................................................................................... 17 • Section 5.4 (Power Consumption Summary): Changed section title from "Current Consumption" to "Power Consumption Summary". .......................................................................................................... 18 • Section 5.11 (Power Sequencing): Updated "There is no power sequencing requirement needed ..." paragraph. ... 27 • Table 5-11 (Internal Zero-Pin Oscillator (INTOSC1/INTOSC2) Characteristics): Updated footnote about oscillator accuracy. ............................................................................................................................ 32 • Table 6-11 (Device Emulation Registers): Added PARTID for TMS320F28027F and TMS320F28026F devices. .... 54 • Table 6-11: Added CLASSID for TMS320F28027F and TMS320F28026F devices. ...................................... 54 • Table 6-11: Added REVID for silicon revision B. ............................................................................... 54 • Figure 6-6 (VREG + POR + BOR + Reset Signal Connectivity): Updated figure. ......................................... 56 • Section 6.6.2 (Crystal Oscillator Option): Added "The on-chip crystal oscillator X1 and X2 pins are 1.8-V level signals ..." paragraph. .............................................................................................................. 60 • Figure 6-12 (CPU-watchdog Module): Updated figure. ........................................................................ 64 • Table 6-33 (SPI Master Mode External Timing (Clock Phase = 0)): Parameter 9 [tv(SPCL-SOMI)M, tv(SPCH-SOMI)M]: Changed MIN values to 0. ......................................................................................................... 90 • Table 6-34 (SPI Master Mode External Timing (Clock Phase = 1)): Parameter 11 [tv(SPCH-SOMI)M, tv(SPCL-SOMI)M]: Changed MIN values to 0. ......................................................................................................... 92 • Table 6-35 (SPI Slave Mode External Timing (Clock Phase = 0)): Parameter 16 [tv(SPCL-SOMI)S, tv(SPCH-SOMI)S]: Changed MIN values to 0. ......................................................................................................... 94 • Table 6-36 (SPI Slave Mode External Timing (Clock Phase = 1)): Parameter 18 [tv(SPCL-SOMI)S, tv(SPCH-SOMI)S]: Changed MIN values to 0. ......................................................................................................... 95 • Section 6.9.10 (Pin Multiplexing): Changed title from "GPIO MUX" to "General-Purpose Input/Output (GPIO) MUX". ............................................................................................................................... 111 • Table 6-51 (Analog MUX for 48-Pin PT Package): Added table. ........................................................... 113 • Table 6-52 (Analog MUX for 38-Pin DA Package): Added table. .......................................................... 114 • Section 7 (Applications, Implementation, and Layout): Added section. .................................................... 123 • Section 8 (Device and Documentation Support): Added section. .......................................................... 124 • Section 8.1 (Getting Started): Updated links. ................................................................................. 124 • Figure 8-1 (Device Nomenclature): Updated list of devices. ................................................................ 125 • Section 8.3 (Tools and Software): Added section. ........................................................................... 125 • Section 8.4 (Documentation Support): Updated section. .................................................................... 127 |
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