TPA6132A2

SLOS597A – DECEMBER 2008 – REVISED OCTOBER 2014

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7 Specifications

7.1 Absolute Maximum Ratings

MIN

MAX

UNIT

Supply voltage

VDD

–0.3

6

V

Headphone amplifier supply voltage

HPVDD (do not connect to external supply)

–0.3

1.9

V

INR+, INR-, INL+, INL-

HPVSS

HPVDD +

V

–0.3

0.3

EN, G0, G1

–0.3

HPVDD +

V

0.3

Output continuous total power dissipation

See Thermal Information

–40

85

°C

–40

150

°C

7.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–65

85

°C

Human body model (HBM), per ANSI/ESDA/JEDEC

OUTL, OUTR

–8

–8

kV

Electrostatic

All Other Pins

–2

–2

discharge

Charged device model (CDM), per JEDEC specification JESD22-C101, all

–1.5

1.5

kV

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Condtions

MIN

MAX

UNIT

Supply voltage, VDD

2.3

5.5

V

High-level input voltage; EN, G0, G1

1.3

V

Low-level input voltage; EN, G0, G1

0.6

V

Input voltage; INR+, INR-, INL+, INL-

0

HPVDD +

V

0.3

Voltage applied to Output; OUTR, OUTL (when EN = 0 V)

–0.3

3.6

V

Operating free-air temperature

–40

85

°C

7.4 Thermal Information

RTE

UNIT

16 PINS

Junction-to-ambient thermal resistance

51.1

Junction-to-case (top) thermal resistance

53.9

Junction-to-board thermal resistance

24.3

°C/W

Junction-to-top characterization parameter

0.9

Junction-to-board characterization parameter

24.3

Junction-to-case (bottom) thermal resistance

9.0

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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