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TP3076 Datasheet(PDF) 7 Page - National Semiconductor (TI) |
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TP3076 Datasheet(HTML) 7 Page - National Semiconductor (TI) |
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7 / 18 page  Programmable Functions (Continued) TABLE 8. Byte 2 of Receive Gain Instruction Bit Number 0 dBm0 Test Level (Vrms) 76543210 at VF RO 00000000 No Output (Low Z to GND) 00000001 0.105 00000010 0.107 —— 11111110 1.941 11111111 1.964 Applications Information Figure 2 shows a typical ISDN phone application of the TP3076 together with a TP3420 ISDN Transceiver “S” Inter- face Device and HPC16400 High-Performance Microcontrol- ler with HDLC Controller. The TP3076 device is programmed over its serial control interface via the HPC16400 MICROWIRE/PLUS™ serial I/O port. POWER SUPPLIES While the pins of the TP3076 COMBO II device are well pro- tected against electrical misuse, it is recommended that the standard CMOS practice of applying GND to the device be- fore any other connections are made should always be fol- lowed. In applications where the printed circuit card may be plugged into a hot socket with power and clocks already present, an extra long ground pin on the connector should be used and a Schottky diode connected between V BB and GND. To minimize noise sources all ground connections to each device should meet at a common point as close as possible to the GND pin in order to prevent the interaction of ground return currents flowing through a common bus impedance. Power supply decoupling capacitors of 0.1 µF should be connected from this common point to V CC and VBB as close to the device pins as possible. Further guidelines on PCB layout techniques are provided in Application Note AN-614, “COMBO II™ Programmable PCM CODEC/Filter Family Application Guide”. www.national.com 7 |
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Similar Description - TP3076 |
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