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TPS61165 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS61165 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 33 page 4 TPS61165 SLVS790D – NOVEMBER 2007 – REVISED APRIL 2016 www.ti.com Product Folder Links: TPS61165 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground pin. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN Supply voltages on VIN(2) –0.3 20 V Voltages on CTRL(2) –0.3 20 V Voltage on FB and COMP(2) –0.3 3 V Voltage on SW(2) –0.3 40 V PD Continuous power dissipation See Thermal Information TJ Operating junction temperature –40 150 °C Tstg Storage temperature –65 150 °C (1) These values are recommended values that have been successfully tested in several applications. Other values may be acceptable in other applications but should be fully tested by the user. 7.2 Recommended Operating Conditions MIN TYP MAX UNIT VI Input voltage range, VIN 3 18 V VO Output voltage range VIN 38 V L Inductor(1) 10 22 μH fdim PWM dimming frequency 5 100 kHz CIN Input capacitor 1 μF CO Output capacitor 1 10 μF TA Operating ambient temperature –40 85 °C TJ Operating junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953). (2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator. 7.3 Thermal Information THERMAL METRIC(1)(2) TPS61165 UNIT DRV (WSON) DBV (SOT-23) 6 PINS 6 PINS R θJA Junction-to-ambient thermal resistance 80.7 210.1 °C/W RθJC(top) Junction-to-case(top) thermal resistance 55.4 46.8 °C/W RθJB Junction-to-board thermal resistance 140.2 56.7 °C/W ψJT Junction-to-top characterization parameter 0.3 0.5 °C/W ψJB Junction-to-board characterization parameter 36.5 50.2 °C/W RθJC(bottom) Junction-to-case(bottom) thermal resistance 0.9 — °C/W |
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Similar Description - TPS61165_17 |
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