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TS3A225E Datasheet(PDF) 3 Page - Texas Instruments

Part # TS3A225E
Description  AUTONOMOUS AUDIO HEADSET SWITCH
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TS3A225E Datasheet(HTML) 3 Page - Texas Instruments

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TS3A225E
www.ti.com
SCDS329A – AUGUST 2012 – REVISED MAY 2013
PIN DESCRIPTION – WCSP
PIN #
PIN
WCSP
NAME
TYPE
DESCRIPTION
A1
SCL
I/O
Clock from I2C bus. This can be connected to VDD if I2C is not used.
A2
SDA
I/O
Bidirectional data from/to I2C bus. This can be connected to VDD if I2C is not used.
This pin is used to change the device I2C address in an I2C system to avoid address conflict.
A3
ADDR_SEL
I/O
Please see the External Pin Connection section for more details. This pin can be grounded if
not needed.
A rising edge from low to high on this pin triggers the detection. This pin can be connected to
A4
DET_TRIGGER
I/O
the headset jack to allow automatic pull-up to supply after headset insertion to initialize
detection sequence. The detection trigger can be disabled or activated in I2C
Connected to the SLEEVE segment of the jack. If SLEEVE segment on plug is MIC signal,
B1
SLEEVE_SENSE
I/O
this is connected to MICp. If not, this is connected to MICn and becomes the remote sensing
feedback for the headphone.
B2
VDD
Supply
Power supply
Headphone ground connection (Current return path to headphone amplifier), switch ground
B3
GND
Ground
reference.
Headphone current return path if SLEEVE is GND for headset. Connect to SLEEVE with low
B4
SLEEVE
I/O
DCR trace.
Connected to the RING2 segment of the jack. If RING2 segment on plug is MIC signal, this
C1
RING2_SENSE
I/O
is connected to MICp. If not, this is connected to MICn and becomes the remote sensing
feedback for the headphone.
C2
VDD
Supply
Power supply
Headphone ground connection (Current return path to headphone amplifier), switch ground
C3
GND
Ground
reference.
Headphone current return path if RING2 is GND for headset. Connect to RING2 with low
C4
RING2
I/O
DCR trace.
D1
MICn
I/O
Microphone signal reference connection to codec.
D2
MICp
I/O
Microphone signal connection to codec. Microphone bias should be fed into this pin.
D3
TIP_SENSE
I/O
Connected to the TIP segment of the headphone jack
Open Drain output. When pulled-low, it indicate that a mic is detected on the headset (switch
D4
/MIC_PRESENT
Output
for HDA sense resistor or INT output in an I2S based system. Default behavior is a hardware
pulldown for HDA resistor. Programmable through I2C into an interrupt.)
Copyright © 2012–2013, Texas Instruments Incorporated
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