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TPS79801QDGNRQ1 Datasheet(PDF) 6 Page - Texas Instruments |
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TPS79801QDGNRQ1 Datasheet(HTML) 6 Page - Texas Instruments |
6 / 25 page 0 20 40 60 80 100 120 10 20 30 40 50 60 VIN – Input Voltage – V VOUT = 5 V TJ(max) = 125°C 0JA = 50°C/W IOUT = 5 m A IOUT = 30 m A IOUT = 50 m A D C O pe ra t io n T ra ns ie nt ( <5 0 0 m s ) TPS79801-Q1, TPS79850-Q1 SLVS822E – MARCH 2009 – REVISED SEPTEMBER 2015 www.ti.com Electrical Characteristics (continued) VIN = VOUT(NOM) + 1 V or 4 V (whichever is greater for either fixed or adjustable versions), ILOAD = 1 mA, VEN = 3 V, COUT = CIN = 2.2 μF (unless otherwise noted). For TPS79801, FB pin tied to VOUT. Typical values are at TJ = 25°C. PARAMETER TEST CONDITIONS TJ (1) MIN TYP MAX UNIT Input reverse leakage IRL VIN = –60 V, VOUT = open, CIN open Full range 6 mA current(reverse battery test) IRO Reverse output current(10) VOUT = VOUT(NOM), VIN = ground 25°C 19 25 μA Shutdown, temperature increasing 135 Thermal shutdown temperature TSD °C (TJ) (11) Reset, temperature decreasing 135 (10) Reverse output current is tested with the IN pin tied to ground and the output forced to VOUT(NOM) +0.1 V. This current flows into the OUT pin and out of the GND pin and then measured. (11) Specified by design Figure 1. Safe Operating Area 6.6 Dissipation Ratings (1) DERATING FACTOR TA ≤ 25°C TA = 70°C TA = 85°C BOARD PACKAGE ABOVE TA = 25°C POWER RATING POWER RATING POWER RATING High-K(2) DGN 16.6 mW/°C 1.83 W 1.08 W 0.833 W (1) See Thermal Considerations for more information related to thermal design. (2) The JEDEC High-K (1s) board design used to derive this data was a 4.5-inch × 3-inch, 2-layer board with 2-ounce copper traces on top of the board. 6 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: TPS79801-Q1 TPS79850-Q1 |
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