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DEMO-VMMK-1218-10 Datasheet(PDF) 10 Page - Broadcom Corporation. |
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DEMO-VMMK-1218-10 Datasheet(HTML) 10 Page - Broadcom Corporation. |
10 / 12 page 10 Recommended SMT Attachment The VMMK Packaged Devices are compatible with high volume surface mount PCB assembly processes. Manual Assembly for Prototypes 1. Follow ESD precautions while handling packages. 2. Handling should be along the edges with tweezers or from topside if using a vacuum collet. 3. Recommended attachment is solder paste. Please see Figure 8 for recommended solder reflow profile. Conductive epoxy is not recommended. Hand soldering is not recommended. 4. Apply solder paste using either a stencil printer or dot placement. The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical and electrical performance. Excessive solder will degrade RF performance. 5. Follow solder paste and vendor’s recommendations when developing a solder reflow profile. A standard profile will have a steady ramp up from room temperature to the pre-heat temp to avoid damage due to thermal shock. 6. Packages have been qualified to withstand a peak temperature of 260ºC for 20 to 40 sec. Verify that the profile will not expose device beyond these limits. 7. Clean off flux per vendor’s recommendations. 8. Clean the module with Acetone. Rinse with alcohol. Allow the module to dry before testing. Figure 15. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste Outline Drawing Top and Side View Notes: 1. x indicates pin 1 2. Dimensions are in millimeters 3. Pad Material is minimum 5.0 um thick Au Notes: 1. 0.010” Rogers RO4350 Suggested PCB Material and Land Pattern Part Number Ordering Information Part Number No. of Devices Container VMMK-1218-BLKG 100 antistatic bag VMMK-1218-TR1G 5000 7” Reel 0 50 100 150 200 250 300 050 100 150 200 250 300 SECONDS Ramp 1 Preheat Ramp 2Reflow Peak = 250 ± 5 °C Melting point = 218 °C Cooling 1.2 (0.048) 0.100 (0.004) 0.500 (0.020) 0.500 (0.020) 0.400 (0.016) 0.100 (0.004) 0.254 dia PTH (0.010) 4pl 0.400 dia (0.016) 4pl 0.200 (0.008) 0.381 (0.015) 2pl 0.200 (0.008) Part of Input Circuit Part of Output Circuit 0.076 max (0.003) 2pl - see discussion Solder Mask 0.7 (0.028) BYY 0.2 mm 0.3 mm 0.7 mm 0.8 mm 0.5 mm 0.5 mm 1.00 mm 0.25 mm Bottom View |
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