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BQ25606 Datasheet(PDF) 5 Page - Texas Instruments |
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BQ25606 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 43 page  5 bq25606 www.ti.com SLUSCK6 – MAY 2017 Product Folder Links: bq25606 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (continued) Terminal I/O Description Name No. STAT 5 DO Open-drain interrupt output. Connect the STAT pin to a logic rail via 10-k Ω resistor. The STAT pin indicates charger status. Charge in progress: LOW Charge complete or charger in SLEEP mode: HIGH Charge suspend (fault response): BlinK at 1Hz SW 19 P Switching node connecting to output inductor. Internally SW is connected to the source of the n-channel HSFET and the drain of the n-channel LSFET. Connect the 0.047-μF bootstrap capacitor from SW to BTST. 20 SYS 15 P Converter output connection point. The internal current sensing resistor is connected between SYS and BAT. Connect a 20 µF capacitor close to the SYS pin. 16 TS 11 AI Temperature qualification voltage input to support JEITA profile. Connect a negative temperature coefficient thermistor. Program temperature window with a resistor divider from REGN to TS to GND. Charge suspends when TS pin voltage is out of range. Recommend 103AT-2 thermistor. VAC 1 AI Input voltage sensing. When VAC voltage is below ACOV threshold and above UVLO, external OVPFET turns on. If exteral OVP is not used, This pin must be shorted to VBUS pin. VBUS 24 P Charger input voltage. The internal n-channel reverse block MOSFET (RBFET) is connected between VBUS and PMID with VBUS on source. Place a 1-uF ceramic capacitor from VBUS to GND and place it as close as possible to IC. VSET 12 AI VSET pin sets default battery charge voltage in bq25606. Program battery regulation voltage with a resistor pull-down from VSET to GND. RPD > 50kΩ (float pin) = 4.208 V RPD < 500Ω (short to GND) = 4.352 V 5kΩ < RPD < 25kΩ = 4.400 V Thermal Pad P Ground reference for the device that is also the thermal pad used to conduct heat from the device. This connection serves two purposes. The first purpose is to provide an electrical ground connection for the device. The second purpose is to provide a low thermal-impedance path from the device die to the PCB. This pad should be tied externally to a ground plane. |
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