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AS4C256M8D3-12BAN Datasheet(PDF) 9 Page - Alliance Semiconductor Corporation

Part # AS4C256M8D3-12BAN
Description  8 internal banks for concurrent operation
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Manufacturer  ALSC [Alliance Semiconductor Corporation]
Direct Link  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

AS4C256M8D3-12BAN Datasheet(HTML) 9 Page - Alliance Semiconductor Corporation

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Functional Description
The DDR3 SDRAM is a high-speed dynamic random access memory internally configured as an eight-bank DRAM.
The DDR3 SDRAM uses an 8n prefetch architecture to achieve high speed operation. The 8n Prefetch architecture
is combined with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or
write operation for the DDR3 SDRAM consists of a single 8n-bit wide, four clock data transfer at the internal DRAM
core and two corresponding n-bit wide, one-half clock cycle data transfers at the I/O pins.
Read and write operation to the DDR3 SDRAM are burst oriented, start at a selected location, and continue for a
burst length of eight or a ‘chopped’ burst of four in a programmed sequence. Operation begins with the registration
of an Active command, which is then followed by a Read or Write command. The address bits registered coincident
with the Active command are used to select the bank and row to be activated (BA0-BA2 select the bank; A0-A14
select the row). The address bit registered coincident with the Read or Write command are used to select the
starting column location for the burst operation, determine if the auto precharge command is to be issued (via A10),
and select BC4 or BL8 mode ‘on the fly’ (via A12) if enabled in the mode register.
Prior to normal operation, the DDR3 SDRAM must be powered up and initialized in a predefined manner. The
following sections provide detailed information covering device reset and initialization, register definition, command
descriptions and device operation.
Figure 4. Reset and Initialization Sequence at Power-on Ramping
CK#
VDDQ
Tb
Tc
Td
Te
Tf
Tg
Th
Ti
Tj
Ta
RESET#
CK
tCKSRX
Tk
T=200µs
T=500µs
tDLLK
tXPR
tMRD
tMRD
tMRD
tMOD
tZQinit
MRS
Note 1
MRS
MRS
MRS
ZQCL
Note 1
VALID
MR3
MR2
MR1
MR0
VALID
VALID
VDD
CKE
BA
ODT
RTT
Tmin=10ns
tIS
tIS
tIS
tIS
Static LOW in case RTT_Nom is enabled at time Tg, otherwise static HIGH or LOW
Don't Care
TIME BREAK
NOTE 1. From time point “Td”until “Tk”NOP or DES commands must be applied between MRS and ZQCL commands.
COMMAND
 
 
 
 
2Gb Auto-AS4C256M8D3
Confidential
-9/82-
Rev.1.0
June 2015


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