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16MX16-DDR1-AS4C16M16D1A Datasheet(PDF) 5 Page - Alliance Semiconductor Corporation

Part # 16MX16-DDR1-AS4C16M16D1A
Description  Auto Refresh and Self Refresh
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Manufacturer  ALSC [Alliance Semiconductor Corporation]
Direct Link  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

16MX16-DDR1-AS4C16M16D1A Datasheet(HTML) 5 Page - Alliance Semiconductor Corporation

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Pin Descriptions
Table 2. Pin Details
Symbol
Type
Description
CK, CK
Input
Differential Clock: CK, CK are driven by the system clock. All SDRAM input signals
are sampled on the positive edge of CK. Both CK and CK increment the internal
burst counter and controls the output registers.
CKE
Input
Clock Enable: CKE activates (HIGH) and deactivates (LOW) the CK signal. If CKE
goes low synchronously with clock, the internal clock is suspended from the next
clock cycle and the state of output and burst address is frozen as long as the CKE
remains low. When all banks are in the idle state, deactivating the clock controls the
entry to the Power Down and Self Refresh modes.
BA0, BA1
Input
Bank Activate: BA0 and BA1 define to which bank the BankActivate, Read, Write, or
BankPrecharge command is being applied.
A0-A12
Input
Address Inputs: A0-A12 are sampled during the BankActivate command (row
address A0-A12) and Read/Write command (column address A0-A8 with A10 defining
Auto Precharge).
CS
Input
Chip Select: CS enables (sampled LOW) and disables (sampled HIGH) the
command decoder. All commands are masked when CS is sampled HIGH. CS
provides for external bank selection on systems with multiple banks. It is considered
part of the command code.
RAS
Input
Row Address Strobe: The RAS signal defines the operation commands in
conjunction with the CAS and WE signals and is latched at the positive edges of
CK. When RAS and CS are asserted "LOW" and CAS is asserted "HIGH," either
the BankActivate command or the Precharge command is selected by the WE
signal. When the WE is asserted "HIGH," the BankActivate command is selected and
the bank designated by BA is turned on to the active state. When the WE is asserted
"LOW," the Precharge command is selected and the bank designated by BA is
switched to the idle state after the precharge operation.
CAS
Input
Column Address Strobe: The CAS signal defines the operation commands in
conjunction with the RAS and WE signals and is latched at the positive edges of
CK. When RAS is held "HIGH" and CS is asserted "LOW," the column access is
started by asserting CAS "LOW." Then, the Read or Write command is selected by
asserting WE "HIGH" or “LOW”.
WE
Input
Write Enable: The WE signal defines the operation commands in conjunction with
the RAS and CAS signals and is latched at the positive edges of CK. The WE input
is used to select the BankActivate or Precharge command and Read or Write
command.
LDQS,
UDQS
Input /
Output
Bidirectional Data Strobe: Specifies timing for Input and Output data. Read Data
Strobe is edge triggered. Write Data Strobe provides a setup and hold time for data
and DQM. LDQS is for DQ0~7, UDQS is for DQ8~15.
LDM,
UDM
Input
Data Input Mask: Input data is masked when DM is sampled HIGH during a write
cycle. LDM masks DQ0-DQ7, UDM masks DQ8-DQ15.
DQ0 - DQ15
Input /
Output
Data I/O: The DQ0-DQ15 input and output data are synchronized with positive and
negative edges of LDQS and UDQS. The I/Os are byte-maskable during Writes.
 
 
 
 
16Mx16 DDR1-AS4C16M16D1A
Confidential
- 5/64 -
Rev.1.1
July 2015


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