CM1216

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2

PACKAGE / PINOUT DIAGRAMS

Top View

CH1

CH2

CH3

CH6

CH5

CH4

8−Pin MSOP−8

1

2

3

4

8

7

6

5

Top View

CH1

CH2

CH3

CH6

CH5

CH4

8−Pin SOIC−8

1

2

3

4

8

7

6

5

Top View

CH1

CH2

CH4

CH8

CH7

CH6

1

2

3

4

10

9

8

7

CH3

CH5

56

10−Pin MSOP−10

Table 1. PIN DESCRIPTIONS

Pin Name

MSOP−8

SOIC−8

MSOP−10

Type

Description

Pin No.

Pin No.

Pin No.

CH1

1

1

1

I/O

ESD Channel

CH2

2

2

2

I/O

ESD Channel

CH3

4

4

3

I/O

ESD Channel

CH4

5

5

4

I/O

ESD Channel

3

3

5

GND

Negative voltage supply rail

CH5

6

6

6

I/O

ESD Channel

CH6

8

8

7

I/O

ESD Channel

7

7

8

PWR

Positive voltage supply rail

CH7

−

−

9

I/O

ESD Channel

CH8

−

−

10

I/O

ESD Channel

SPECIFICATIONS

Table 2. ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Units

6

V

Diode Forward DC Current

20

mA

DC Voltage at any Channel Input

V

Operating Temperature Range

Ambient

Junction

−40 to +85

−40 to +125

°C

Storage Temperature Range

−40 to +150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

Table 3. STANDARD OPERATING CONDITIONS

Parameter

Rating

Units

Temperature Range (Ambient)

−40 to +85

°C

Package Power Rating

MSOP8 Package (CM1216−06MR)

SOIC8 Package (CM1216−06SM)

MSOP10 Package (CM1216−08MR)

400

600

400

mW