CM1230

http://onsemi.com

6

APPLICATION INFORMATION

Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS

Parameter

Value

Pad Size on PCB

0.275 mm

Pad Shape

Round

Pad Definition

Non−Solder Mask defined pads

Solder Mask Opening

0.325 mm Round

Solder Stencil Thickness

0.125 − 0.150 mm

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)

0.330 mm Round

Solder Flux Ratio

50/50 by volume

Solder Paste Type

No Clean

Pad Protective Finish

OSP (Entek Cu Plus 106A)

Tolerance − Edge To Corner Ball

±50 mm

Solder Ball Side Coplanarity

±20 mm

Maximum Dwell Time Above Liquidous

60 seconds

Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste

260°C

Non−Solder Mask Defined Pad

0.275 mm DIA.

Solder Stencil Opening

0.330 mm DIA.

Solder Mask Opening

0.325 mm DIA.

Figure 5. Recommended Non−Solder Mask Defined Pad Illustration

Figure 6. Lead−free (SnAgCu) Solder Ball Reflow Profile