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CM1293A-04SO Datasheet(PDF) 1 Page - ON Semiconductor |
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CM1293A-04SO Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 6 page Semiconductor Components Industries, LLC, 2012 January, 2012 − Rev. 0 1 Publication Order Number: CM1293A−04SO/D CM1293A-04SO 4-Channel Low Capacitance ESD Protection Array Product Description CM1293A−04SO has been designed to provide ESD protection for electronic components or subsystems requiring minimal capacitive loading. This device is ideal for protecting systems with high data and clock rates or for circuits requiring low capacitive loading. Each ESD channel consists of a pair of diodes in series that steer the positive or negative ESD current pulse to either the positive (VP) or negative (VN) supply rail. A Zener diode is embedded between VP and VN which helps protect the VCC rail against ESD strikes. This device protects against ESD pulses up to 8 kV contact discharge) per the IEC 61000−4−2Level 4 standard. This device is particularly well−suited for protecting systems using high−speed ports such as USB2.0, IEEE1394 (FireWire, i.LINK t), Serial ATA, DVI, HDMI, and corresponding ports in removable storage, digital camcorders, DVD−RW drives and other applications where extremely low loading capacitance with ESD protection are required in a small package footprint. Features Four Channels of ESD Protection Provides ESD Protection to IEC61000−4−2 8 kV Contact Discharge Low Loading Capacitance of 2.0 pF Max Low Clamping Voltage Channel I/O to I/O Capacitance 1.5 pF Typical Zener Diode Protects Supply Rail and Eliminates the Need for External By−Pass Capacitors Each I/O Pin Can Withstand over 1000 ESD Strikes* This Device is Pb−Free and is RoHS Compliant** Applications DVI Ports, HDMI Ports in Notebooks, Set Top Boxes, Digital TVs, LCD Displays Serial ATA Ports in Desktop PCs and Hard Disk Drives PCI Express Ports General Purpose High−Speed Data Line ESD Protection **Standard test condition is IEC61000−4−2 level 4 test circuit with each pin subjected to 8 kV contact discharge for 1000 pulses. Discharges are timed at 1 second intervals and all 1000 strikes are completed in one continuous test run. The part is then subjected to standard production test to verify that all of the tested parameters are within spec after the 1000 strikes. **For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MARKING DIAGRAM Device Package Shipping† ORDERING INFORMATION http://onsemi.com SC−74 (Pb−Free) 3,000 / Tape & Reel CM1293A−04SO †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. SC−74 SO SUFFIX CASE 318F BLOCK DIAGRAM CH2 CH1 CH3 CH4 VN VP CM1293A−04SO 1 XXXMG G XXX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) |
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