date 03/30/2017

page 1 of 3

cui.com

MODEL: HSS-B20-085H

│ DESCRIPTION: HEAT SINK

FEATURES

• TO-220 package

• round hole for component attachment

• solder pin for secure PCB mounting

• black anodized finish

MODEL

power

@ 75°C ΔT,

nat conv

(°C/W)

@ 1 W,

nat conv

(°C/W)

@ 1 W,

200 LFM

(°C/W)

@ 1 W,

400 LFM

(°C/W)

@ 75°C ΔT,

nat conv

(W)

HSS-B20-085H

22.06

26.05

7.46

5.20

3.40

Note:

1. See performance curves for full thermal resistance details.

PERFORMANCE CURVES

0

10

20

30

40

50

60

70

80

90

100

01

23

45

Dissipated Power (W)

Without Airflow

200 LFM

400 LFM

Heatsink Temperature Rise Above

Ambient (ΔT = Ths - Ta) (°C)

Power

(W)

Natural

Conv.

200 LFM

400 LFM

0

0

0

0

1

26.05

7.46

5.20

2

48.51

14.24

10.69

3

68.48

21.48

16.04

4

86.75

28.25

21.52

5

104.54

35.39

27.11

Ths: “hot spot” temperature measured on the heatsink

Ta: ambient temperature

For more information, please visit the product page.