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FDR4420A Datasheet(PDF) 2 Page - Fairchild Semiconductor

Part # FDR4420A
Description  Single N-Channel, Logic Level, PowerTrench MOSFET
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Manufacturer  FAIRCHILD [Fairchild Semiconductor]
Direct Link  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FDR4420A Datasheet(HTML) 2 Page - Fairchild Semiconductor

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Electrical Characteristics (T
A = 25
O
C unless otherwise noted )
Symbol
Parameter
Conditions
Min
Typ
Max
Units
OFF CHARACTERISTICS
BV
DSS
Drain-Source Breakdown Voltage
V
GS = 0 V, ID = 250 µA
30
V
BV
DSS/TJ
Breakdown Voltage Temp. Coefficient
I
D = 250 µA, Referenced to 25
o C
20
mV /
oC
I
DSS
Zero Gate Voltage Drain Current
V
DS = 24 V, VGS = 0 V
1
µA
T
J = 55°C
10
µA
I
GSS
Gate - Body Leakage Current
V
GS = 20 V, VDS= 0 V
100
nA
I
GSS
Gate - Body Leakage, Reverse
V
GS = -20 V, VDS= 0 V
-100
nA
ON CHARACTERISTICS (Note 2)
V
GS(th)/TJ
Gate Threshold Voltage Temp.Coefficient
I
D = 250 µA, Referenced to 25
o C
-6
mV /
oC
V
GS(th)
Gate Threshold Voltage
V
DS = VGS, ID = 250 µA
1
1.4
3
V
R
DS(ON)
Static Drain-Source On-Resistance
V
GS = 10 V, ID = 11A
0.0075
0.009
T
J =125°C
0.0125
0.016
V
GS = 4.5 V, ID = 9 A
0.01
0.013
I
D(ON)
On-State Drain Current
V
GS = 10 V, VDS = 5 V
30
A
g
FS
Forward Transconductance
V
DS = 10 V, ID= 11 A
25
S
DYNAMIC CHARACTERISTICS
C
iss
Input Capacitance
V
DS = 15 V, VGS = 0 V,
f = 1.0 MHz
2560
pF
C
oss
Output Capacitance
560
pF
C
rss
Reverse Transfer Capacitance
280
pF
SWITCHING CHARACTERISTICS (Note 2)
t
D(on)
Turn - On Delay Time
V
DD = 10 V, ID = 1 A,
V
GS = 10V, RGEN = 1
11
20
ns
t
r
Turn - On Rise Time
15
27
ns
t
D(off)
Turn - Off Delay Time
25
40
ns
t
f
Turn - Off Fall Time
21
34
ns
Q
g
Total Gate Charge
V
DS = 15 V, ID = 9.3 A,
V
GS = 5 V
23
33
nC
Q
gs
Gate-Source Charge
7
nC
Q
gd
Gate-Drain Charge
11
nC
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
I
S
Maximum Continuous Drain-Source Diode Forward Current
1.5
A
V
SD
Drain-Source Diode Forward Voltage
V
GS = 0 V, IS = 1.5 A (Note 2)
0.7
1.2
V
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design
while RθCA is determined by the user's board design. RθJA shown below for single device operation on FR-4 board in still air.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
FDR4420 Rev.D
b. 125
OC/W on a 0.026 in2 of pad
of 2oz copper.
a. 70
OC/W on a 1 in2 pad of 2oz
copper.
c. 135
OC/W on a 0.005 in2 of pad
of 2oz copper.


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