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ABSOLUTE MAXIMUM RATINGS

(1)

RECOMMENDED OPERATING CONDITIONS

DISSIPATION RATINGS

bq25010

bq25011

bq25012

SLUS615 – DECEMBER 2004

These devices have limited built-in ESD protection. The leads should be shorted together or the device

placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

PACKAGE

OUTPUT VOLTAGE (V)

MARKING

Adjustable

bq25010RHLR

ANC

-40

°C to 125°C

3.3

ANE

1.8

ANF

(1)

The RHL package is available taped and reeled only in quantities of 3,000 devices per reel.

(2)

This product is RoHS compatible, including a lead concentration that does not exceed 0.1% of total product weight, and is suitable for

use in specified lead-free soldering processes. In addition, this product uses package materials that do not contain halogens, including

bromine (Br) or antimony (Sb) above 0.1% of total product weight.

(3)

Advanced Information, contact factory for availability.

over operating free-air temperature range (unless otherwise noted)

bq25010

bq25011

bq25012

Supply voltage

AC, USB (wrt VSS)

–0.3 V to 7 V

PG, OUT, ISET1, ISET2, STAT1, STAT2, TS (wrt VSS)

–0.3 V to 7 V

Input voltage

EN, FB, FPWM, SW (wrt VSS)

PG, STAT1, STAT2

15 mA

Output sink/source current

TS

200 µA

Output source current

OUT

1.5 A

–65

°C to 150°C

0

°C to 125°C

Lead temperature (solderig, 10 seconds)

260

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage

values are with respect to the network ground terminal unless otherwise noted.

MIN

MAX

UNIT

Supply voltage (from AC input)

4.5

6.5

V

Supply voltage (from USB input)

4.35

6.5

Operating junction temperature range

–40

125

°C

DERATING FACTOR

PACKAGE

θ

JA

POWER RATING

1.81 W

21 mW/

°C

46.87

°C/W

(1)

This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is

connected to the ground plane by a 2

×3 via matrix.

2