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CMS06 Datasheet(PDF) 3 Page - Toshiba Semiconductor |
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CMS06 Datasheet(HTML) 3 Page - Toshiba Semiconductor |
3 / 5 page CMS06 2003-02-17 3 0 5 0.001 500 0.01 10 1 10 100 0.1 1 100 1000 Device mounted on a glass-epoxy board Soldering land: 6 0 mm ´ 6.0 mm Device mounted on a ceramic board Soldering land: 2 0 mm ´ 2.0 mm Device mounted on a glass-epoxy board Soldering land: 2.1 mm ´ 1.4 mm iF - vF PF (AV) - IF (AV) Tℓ max - IF (AV) Cj - VR (typ.) Instantaneous forward voltage vF (V) Average forward current IF (AV) (A) Average forward current IF (AV) (A) Reverse voltage VR (V) 0.1 0 0 1 10 100 0.1 0 2 0 3 0.4 0 5 0 6 0.7 0 8 Tj = 125°C 25°C 75°C 10 1 1000 10 100 100 f = 1 MHz Ta = 25°C 0 0 0 0 0 3 0.7 1 0 0.4 0 8 1 2 1.6 2 0 2.4 2.8 3 2 0.1 0 2 0.4 0 5 0 6 0 8 0 9 a = 120° a = 60° a = 180° DC 360° 0° a Rectangular waveform Conduction angle: a 140 0 0 0 40 100 0.4 0 8 1 2 1.6 2 0 2.4 2.8 3 2 20 60 80 120 a = 120° a = 180° a = 60° DC 360° 0° a Rectangular waveform Conduction angle: a VR = 15 V IF (AV) Time t (s) rth (j-a) - t |
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