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VC0805L401R011 Datasheet(PDF) 9 Page - Kemet Corporation

Part # VC0805L401R011
Description  Surface Mount Varistors
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Manufacturer  KEMET [Kemet Corporation]
Direct Link  http://www.kemet.com
Logo KEMET - Kemet Corporation

VC0805L401R011 Datasheet(HTML) 9 Page - Kemet Corporation

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
V0002_VC • 10/26/2016
Surface Mount Varistors
VC Series Low Voltage 125°C
Soldering cont'd
WheneverseveraldifferenttypesofSMDcomponentsarebeingsoldered,eachhavingaspecificsolderingprofile,thesolderingprofile
with the least heat and the minimum amount of heating time is recommended. Once soldering has been completed, it is necessary to
minimizethepossibilityofthermalshockbyallowingthehotPCBtocooltolessthan50°Cbeforecleaning.
Inspection Criteria–theinspectioncriteriatodetermineacceptablesolderjoints,whenWaveorInfraredReflowprocessesareused,will
dependonseveralkeyvariables,principallyterminationmaterialprocessprofiles.
Pb-contining Wave and IR Reflow Soldering – typical “before” and “after” soldering results for Barrier Type End Terminations can be seen
in Fig. 4. Barrier type terminated varistors form a reliable electrical contact and metallurgical bond between the end terminations and the
solder pads. The bond between these two metallic surfaces is exceptionally strong and has been tested by both vertical pull and lateral
(horizontal) push tests. The results exceed established industry standards for adhesion.
The solder joint appearance of a barrier type terminated varistor shows that solder forms a metallurgical junction with the thin tin-alloy
(over the barrier layer), and due to its small volume “climbs” the outer surface of the terminations, the meniscus will be slightly lower.
This optical appearance should be taken into consideration when programming visual inspection of the PCB after soldering.
Ni Sn Barrier Type End Terminations
Fig.4–SolderingCriterionincaseofWaveandIRReflowPb-containingSoldering
Pb-free Wave and IR Reflow Soldering – typical “before” and “after” soldering results for Barrier Type End Terminations are given
in a phenomenon knows as “mirror” or “negative” meniscus. Solder forms a metallurgical junction with the entire volume of the end
termination, i.e. it diffuses from pad to end termination across the inner side, forming a “mirror” or “negative” meniscus. The height of the
solder penetration can be clearly seen on the end termination and is always 30% higher than the chip height.


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