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VC0805L102R014 Datasheet(PDF) 9 Page - Kemet Corporation |
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VC0805L102R014 Datasheet(HTML) 9 Page - Kemet Corporation |
9 / 15 page 9 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V0002_VC • 10/26/2016 Surface Mount Varistors VC Series Low Voltage 125°C Soldering cont'd WheneverseveraldifferenttypesofSMDcomponentsarebeingsoldered,eachhavingaspecificsolderingprofile,thesolderingprofile with the least heat and the minimum amount of heating time is recommended. Once soldering has been completed, it is necessary to minimizethepossibilityofthermalshockbyallowingthehotPCBtocooltolessthan50°Cbeforecleaning. Inspection Criteria–theinspectioncriteriatodetermineacceptablesolderjoints,whenWaveorInfraredReflowprocessesareused,will dependonseveralkeyvariables,principallyterminationmaterialprocessprofiles. Pb-contining Wave and IR Reflow Soldering – typical “before” and “after” soldering results for Barrier Type End Terminations can be seen in Fig. 4. Barrier type terminated varistors form a reliable electrical contact and metallurgical bond between the end terminations and the solder pads. The bond between these two metallic surfaces is exceptionally strong and has been tested by both vertical pull and lateral (horizontal) push tests. The results exceed established industry standards for adhesion. The solder joint appearance of a barrier type terminated varistor shows that solder forms a metallurgical junction with the thin tin-alloy (over the barrier layer), and due to its small volume “climbs” the outer surface of the terminations, the meniscus will be slightly lower. This optical appearance should be taken into consideration when programming visual inspection of the PCB after soldering. Ni Sn Barrier Type End Terminations Fig.4–SolderingCriterionincaseofWaveandIRReflowPb-containingSoldering Pb-free Wave and IR Reflow Soldering – typical “before” and “after” soldering results for Barrier Type End Terminations are given in a phenomenon knows as “mirror” or “negative” meniscus. Solder forms a metallurgical junction with the entire volume of the end termination, i.e. it diffuses from pad to end termination across the inner side, forming a “mirror” or “negative” meniscus. The height of the solder penetration can be clearly seen on the end termination and is always 30% higher than the chip height. |
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