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SKY66294-11 Datasheet(PDF) 7 Page - Skyworks Solutions Inc. |
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SKY66294-11 Datasheet(HTML) 7 Page - Skyworks Solutions Inc. |
7 / 14 page DATA SHEET • SKY66297-11: 2490 TO 2690 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 203323E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 31, 2017 7 -16 -15 -14 -13 -12 -11 -10 -9 -8 256025802600 2620 2640 26602680 2700 Frequency (MHz) –40 °C 25 °C 85 °C Figure 15. Input Return Loss vs Frequency Across Temperature (PIN = −20 dBm) -27 -25 -23 -21 -19 -17 -15 25602580 2600 2620 2640 26602680 2700 Frequency (MHz) –40 °C 25 °C 85 °C Figure 16. Output Return Loss vs Frequency Across Temperature (PIN = −20 dBm) Evaluation Board Description The SKY66297-11 Evaluation Board is used to test the performance of the SKY66297-11 PA. An Evaluation Board schematic is provided in Figure 17. Table 6 provides the Bill of Materials (BOM) list for Evaluation Board components. An assembly drawing for the Evaluation Board is shown in Figure 18. Board layer details are shown in Figure 19. Layer detail physical characteristics are noted in Figure 20. Circuit Design Considerations The following design considerations are general in nature and must be followed regardless of final use or configuration: Paths to ground should be made as short as possible. The ground pad of the SKY66297-11 has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Because the circuit board acts as the heat sink, it must shunt as much heat as possible from the device. Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required. NOTE: A poor connection between the ground pad and ground increases junction temperature (TJ), which reduces the life of the device. Evaluation Board Test Procedure Turn-On Sequence 1. Connect 50 Test Equipment or Load to the input and output RF ports of the Evaluation Board. 2. Connect the DC ground. 3. Connect all VCCs and VBIAS lines to a +5 V supply. Connect PAEN to a 2.0 V supply. 4. Without applying RF, turn on the 5 V supply, then turn on the 2 V PAEN. 5. Apply RF signal data at –30 dBm and observe that the gain of the device complies with values in Table 5. Begin measurements. Turn-Off Sequence 1. Turn off the RF input to the device. 2. Turn off PAEN (set to 0 V). 3. Turn off all VCCs and VBIAS. NOTE: It is important to adjust the VCC voltage sources so that +5 V is measured at the board. High collector currents drop the collector voltage significantly if long leads are used. Adjust the bias voltage to compensate. |
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