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BQ294592DRVR Datasheet(PDF) 5 Page - Texas Instruments |
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BQ294592DRVR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 26 page 5 bq294502, bq294504, bq294512, bq294514 bq294515, bq294522, bq294524, bq294532 bq294533, bq294562, bq294572, bq294582, bq294592 www.ti.com SLUSAJ3F – SEPTEMBER 2011 – REVISED JUNE 2017 Product Folder Links: bq294502 bq294504 bq294512 bq294514 bq294515 bq294522 bq294524 bq294532 bq294533 bq294562 bq294572 bq294582 bq294592 Submit Documentation Feedback Copyright © 2011–2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) See Figure 8. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Supply voltage VDD–VSS –0.3 30 V Input voltage V1–VSS or V2–VSS or V3–VSS+ –0.3 30 V V3–V2 or V2–V1 –0.3 8 V Output voltage OUT–VSS –0.3 30 V Continuous total power dissipation, PTOT See Thermal Information Lead temperature (soldering, 10 s), TSOLDER 300 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) See Typical Application. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage, VDD (1) 3 25 V Input voltage V3–V2 or V2–V1 or V1–VSS 0 5 V Operating ambient temperature, TA –40 110 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) bq2945xx UNIT DRV (SON) 6 PINS RθJA Junction-to-ambient thermal resistance 186.4 °C/W RθJC(top) Junction-to-case(top) thermal resistance 90.4 °C/W RθJB Junction-to-board thermal resistance 110.7 °C/W ψJT Junction-to-top characterization parameter 96.7 °C/W ψJB Junction-to-board characterization parameter 90 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A °C/W |
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