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ABSOLUTE MAXIMUM RATINGS

(1)

POWER DISSIPATION RATINGS

SN65LVDS100, SN65LVDT100

SN65LVDS101, SN65LVDT101

SLLS516C – AUGUST 2002 – REVISED JUNE 2004

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated

circuits be handled with appropriate precautions. Failure to observe proper handling and installation

procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision

integrated circuits may be more susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

ORDERING INFORMATION

OUTPUT

TERMINATION RESISTOR

PART MARKING

PACKAGE

LVDS

No

Yes

SN65LVDS100D

DL100

SOIC

LVDS

No

Yes

SN65LVDS100DGK

AZK

MSOP

LVDS

Yes

No

SN65LVDT100D

DE100

SOIC

LVDS

Yes

No

SN65LVDT100DGK

AZL

MSOP

LVPECL

No

Yes

SN65LVDS101D

DL101

SOIC

LVPECL

No

Yes

SN65LVDS101DGK

AZM

MSOP

LVPECL

Yes

No

SN65LVDT101D

DE101

SOIC

LVPECL

Yes

No

SN65LVDT101DGK

BAF

MSOP

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Add the suffix R for taped and reeled carrier (i.e. SN65LVDS100DR).

over operating free-air temperature range unless otherwise noted

UNIT

–0.5 V to 4 V

±0.5 mA

Voltage range, (A, B, Y, Z)

0 V to 4.3 V

1 V

A, B, Y, Z, and GND

±5 kV

ESD

All pins

±2 kV

All pins

±1500 V

Continuous power dissipation

See Dissipation Rating Table

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.

(3)

Tested in accordance with JEDEC Standard 22, Test Method A114-A.7.

(4)

Tested in accordance with JEDEC Standard 22, Test Method C101.

PACKAGE

POWER RATING

POWER RATING

DGK

377 mW

3.8 mW/

°C

151 mW

D

481 mW

4.8 mW/

°C

192 mW

(1)

This is the inverse of the junction-to-ambient thermal resistance with no air flow installed on the JESD51-3 low effective thermal

conductivity test board for leadless surface mount packages.

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