Schottky Barrier

Diodes

20 to 200 Volts

Features

•

•

Low Forward Voltage

•

Low Profile Package

Symbol

Parameter

Rating

Unit

Maximum RMS Voltage

SMD22PL

SMD24PL

14

28

V

Repetitive Peak Reverse Voltage SMD22PL

SMD24PL

20

40

V

Rectified Current (Average) Half Wave

2.0

A

Surge Forward Current,halfsine wave 8.3ms

50

A

Junction Temperature

-65 to +150

Storage Temperature

-65 to +150

Electrical Characteristics @ 25

Symbol

Parameter

Min

Typ

Max

Units

Forward Voltag

SMD22PL~24PL

SMD26PL

---

---

---

---

0.50

0.65

V

@f=1.0MHz,Vr=4V

---

210

---

pF

0.036”

0.093”

0.048”

SUGGESTED SOLDER

PAD LAYOUT

DIMENSIONS

INCHES

MM

DIM

MIN

MAX

MIN

MAX

NOTE

A

.140

.152

3.55

3.85

B

.100

.112

2.55

2.85

C

.055

.071

1.40

1.80

D

.037

.053

0.95

1.35

E

.020

.039

0.50

1.00

G

.010

-----

0.25

-----

H

-----

.008

----

.20

A

B

E

C

D

H

G

SOD-123FL

Maximum Ratings

M

echanical Data

•

Packaging: SOD-123FL

•

Marking Code: SMD22PL---M2; SMD24PL---M4; SMD26PL---M6

SMD210PL---M10; SMD220PL---M20;

SMD26PL

SMD210PL

SMD220PL

SMD26PL

SMD210PL

SMD220PL

60

100

200

42

70

140

2. Thermal Resistance:PC Board Mounted on 0.2*0.2''(5*5mm) copper pad area.

(@2A dc)

Typical Thermal Resistance

(Note2)

60

30

21

Power Dissipation

1.68

W

SMD210PL~220PL

0.85

---

---

Maximum DC Reverse Current

0.2

mA

---

---

Notes: 1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7.

•

Epoxy meets UL 94 V-0 flammability rating

•

Moisture Sensitivity Level 1

•

Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates

Compliant. See ordering information)

SMD22PL

THRU SMD220PL

2