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ADG3247 Datasheet(PDF) 3 Page - Analog Devices |
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ADG3247 Datasheet(HTML) 3 Page - Analog Devices |
3 / 12 page PRELIMINARY TECHNICAL DATA REV. PrD ADG3247 –3– ABSOLUTE MAXIMUM RATINGS * (TA = 25 °C, unless otherwise noted.) VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150 °C LFCSP Package θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 32 °C/W TSSOP Package θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 98°C/W Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300 °C IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235 °C *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the opera tional sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG3247 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Table I. Pin Description Mnemonic Description BEx Bus Enable (Active Low) SEL Level Translation Select Ax Port A, Inputs or Outputs Bx Port B, Inputs or Outputs Table II. Truth Table BEx SEL* Function LL A = B, 3.3 V to 1.8 V Level Shifting LH A = B, 3.3 V to 2.5 V/2.5V to 1.8 V Level Shifting HX Disconnect *SEL = 0 only when VDD = 3.3 V ± 10% PIN CONFIGURATION 40-Lead LFCSP and 38-Lead TSSOP PIN 1 INDICATOR TOP VIEW ADG3247 1 A6 2 A7 3 A8 4 A9 5 A10 6 A11 7 A12 8 A13 9 A14 10 A15 NC = NO CONNECT 30 B0 29 B1 28 B2 27 B3 26 B4 25 B5 24 B6 23 B7 22 B8 21 B9 TOP VIEW (Not to Scale) 38 37 36 35 34 33 32 1 2 3 4 5 6 7 SEL A0 A1 A2 A3 A4 A5 VCC BE2 BE1 B0 B1 B2 B3 ADG3247 31 30 29 8 9 10 A6 A7 A8 B4 B5 B6 28 27 11 12 A9 A10 B7 B8 26 25 A11 A12 B9 B10 24 23 22 17 A13 A14 A15 B11 B12 B13 21 20 18 19 GND NC B14 B15 13 14 15 16 ORDERING GUIDE Model Temperature Range Package Description Package Option ADG3247BCP –40 °C to +85°CLeaded Chip Scale Package (LFCSP) CP-40 ADG3247BRU –40 °C to +85°CThin Shrink Small Outline Package (TSSOP) RU-38 |
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