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AP1212LN Datasheet(PDF) 9 Page - Anachip Corp |
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AP1212LN Datasheet(HTML) 9 Page - Anachip Corp |
9 / 11 page AP1212 Dual USB High-Side Power Switch Anachip Corp. www.anachip.com.tw Rev.1.0 Sep.23, 2004 9/11 Function Description Error Flag An open-drained output of N-channel MOSFET, the FLG output is pulled low to signal the following fault conditions: input undervoltage, output current limit, and thermal shutdown. Current Limit The current limit threshold is preset internally. It protects the output MOSFET switches from damage due to undesirable short circuit conditions or excess inrush current often encountered during hot plug-in. The low limit of the current limit threshold of the AP1212 allows a minimum current of 0.5A through the MOSFET switches. A current limit condition will signal the error flag. Thermal Shutdown When the chip temperature exceeds 140ºC for any reason other than overcurrent fault of either one of the two MOSFET switches, the thermal shutdown function turns off both MOSFET switches and signal the error flag. A hysteresis of 10ºC prevents the MOSFETs from turning back on until the chip temperature drops to below 130ºC. Supply Filtering A 0.1µF to 1µF bypass capacitor from IN to GND, located near the device, is strongly recommended to control supply transients. Without a bypass capacitor, an output short may cause sufficient ringing on the input (from supply lead inductance) to damage internal control circuitry. Transient Droop Requirements USB support dynamic attachment (hot plug-in) of peripherals. A current surge is caused by the input capacitance of downstream device. Ferrite beads are recommended in series with all power and ground connector pins. Ferrite beads reduce EMI and limit the inrush current during hot-attachment by filtering high-frequency signals. Short Circuit Transient Bulk capacitance provides the short-term transient current needed during a hot-attachment event. With a 33µF, 16V tantalum or 100µF, 10V electrolytic capacitor mounted close to downstream connector per port should provide transient drop protection. Printed Circuit Layout The power circuitry of USB printed circuit boards requires a customized layout to maximize thermal dissipation and to minimize voltage drop and EMI. Marking Information Part Number 1 4 PDIP/SOP Logo Enable Type H: Active High L: Active Low ID code: internal Year: "01" =2001 "02" =2002 Xth week: 01~52 8 5 AP1212 X YY WW X X (Top View) Blank: normal L: Lead Free Package |
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