© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com

T2079_SSD • 9/27/2016 11

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Solid State Drives/High Energy Applications

Soldering Process

KEMET’s families of surface mount capacitors are

compatible with wave (single or dual), convection, IR,

or vapor phase reflow techniques. Preheating of these

components is recommended to avoid extreme thermal

stress. KEMET's recommended profile conditions for

convection and IR reflow reflect the profile conditions of the

IPC/J–STD–020D standard for moisture sensitivity testing.

The devices can safely withstand a maximum of three reflow

passes at these conditions.

Please note that although the X/7343–43 and O/7360-43

case size can withstand wave soldering, the tall profile

(4.3 mm maximum) dictates care in wave process

development.

Hand soldering should be performed with care due to the

difficulty in process control. If performed, care should be

taken to avoid contact of the soldering iron to the molded

case. The iron should be used to heat the solder pad,

applying solder between the pad and the termination, until

reflow occurs. Once reflow occurs, the iron should be

removed immediately. “Wiping” the edges of a chip and

heating the top surface is not recommended.

Profile Feature

Pb-Free Assembly

Preheat/Soak

Temperature Minimum (T

150°C

Temperature Maximum (T

200°C

Time (t

60 – 120 seconds

Ramp-up Rate (T

3°C/seconds maximum

Liquidous Temperature (T

217°C

Time Above Liquidous (t

60 – 150 seconds

Peak Temperature (T

250°C*

260°C**

Time within 5°C of Maximum

Peak Temperature (t

30 seconds maximum

Ramp-down Rate (T

6°C/seconds maximum

Time 25°C to Peak Temperature

8 minutes maximum

Note: All temperatures refer to the center of the package, measured on the

package body surface that is facing up during assembly reflow.

*Case Size O, Y, and X

**Case Size B, H, J, M, T, V, and W

Storage

All KO-Cap Series are shipped in moisture barrier bags (MBBs) with desiccant and humidity indicator card (HIC). These

parts are classified as MSL3 (Moisture Sensitivity Level 3) or MSL4 (Moisture Sensitivity Level 4) per IPC/JEDEC J-STD-020

and packaged per IPC/JEDEC J–STD–033. Refer to Table 1 for part type specification. MSL3 specifies a floor time of 168H

at 30°C maximum temperature and 60% relative humidity. MSL4 specifies a floor time of 72H at 30°C maximum temperature

and 60% relative humidity. Unused capacitors should be sealed in a MBB with fresh desiccant.

Calculated shelf life in sealed bag:

– 12 months from bag seal date in a storage environment of < 40ºC and humidity < 90% RH

– 24 months from bag seal date in a storage environment of < 30ºC and humidity < 70% RH

If baking is required, refer to IPC/JEDEC J–STD–033 for bake procedure

Time

T

smin

25

T

smax

T

L

T

P

Maximum Ramp Up Rate = 3ºC/sec

Maximum Ramp Down Rate = 6ºC/sec

t

P

t

L

t

s

25ºC to Peak