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HSMS-282F-BLK Datasheet(PDF) 1 Page - Agilent(Hewlett-Packard)

Part # HSMS-282F-BLK
Description  Surface Mount RF Schottky Barrier Diodes
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Manufacturer  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HSMS-282F-BLK Datasheet(HTML) 1 Page - Agilent(Hewlett-Packard)

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1
Surface Mount RF Schottky
Barrier Diodes
Technical Data
HSMS-282x Series
Features
• Low Turn-On Voltage
(As Low as 0.34 V at 1 mA)
• Low FIT (Failure in Time)
Rate*
• Six-sigma Quality Level
• Single, Dual and Quad
Versions
• Unique Configurations in
Surface Mount SOT-363
Package
– increase flexibility
– save board space
– reduce cost
• HSMS-282K Grounded
Center Leads Provide up to
10 dB Higher Isolation
• Matched Diodes for
Consistent Performance
• Better Thermal Conductivity
for Higher Power Dissipation
*
For more information see the
Surface Mount Schottky Reliability
Data Sheet.
Description/Applications
These Schottky diodes are
specifically designed for both
analog and digital applications.
This series offers a wide range of
specifications and package
configurations to give the
designer wide flexibility. Typical
applications of these Schottky
diodes are mixing, detecting,
switching, sampling, clamping,
and wave shaping. The
HSMS-282x series of diodes is the
Package Lead Code Identification, SOT-23/SOT-143
(Top View)
COMMON
CATHODE
#4
UNCONNECTED
PAIR
#5
COMMON
ANODE
#3
SERIES
#2
SINGLE
#0
12
3
12
34
RING
QUAD
#7
12
34
BRIDGE
QUAD
#8
12
34
CROSS-OVER
QUAD
#9
12
34
12
3
12
3
12
3
Package Lead Code
Identification, SOT-323
(Top View)
Package Lead Code
Identification, SOT-363
(Top View)
COMMON
CATHODE
F
COMMON
ANODE
E
SERIES
C
SINGLE
B
COMMON
CATHODE QUAD
M
UNCONNECTED
TRIO
L
BRIDGE
QUAD
P
COMMON
ANODE QUAD
N
RING
QUAD
R
12
3
65
4
HIGH ISOLATION
UNCONNECTED PAIR
K
12
3
65
4
12
3
65
4
12
3
65
4
12
3
65
4
12
3
65
4
best all-around choice for most
applications, featuring low series
resistance, low forward voltage at
all current levels and good RF
characteristics.
Note that Agilent’s manufacturing
techniques assure that dice found
in pairs and quads are taken from
adjacent sites on the wafer,
assuring the highest degree of
match.
88759/02-5.PM6.0J
2001.04.25, 6:40 PM
Page 1
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