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TLE2022MD Datasheet(PDF) 2 Page - Texas Instruments |
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TLE2022MD Datasheet(HTML) 2 Page - Texas Instruments |
2 / 77 page TLE202x, TLE202xA, TLE202xB, TLE202xY EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS SLOS191D − FEBRUARY 1997 − REVISED NOVEMBER 2010 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLE2021 AVAILABLE OPTIONS PACKAGED DEVICES CHIP TA VIOmax AT 25°C SMALL OUTLINE† (D) SSOP‡ (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP‡ (PW) CHIP FORM§ (Y) 0°C to 200 μV TLE2021ACD TLE2021CDBLE TLE2021ACP — — 0 C to 70°C 200 μV 500 μV TLE2021ACD TLE2021CD TLE2021CDBLE — — TLE2021ACP TLE2021CP TLE2021CPWLE TLE2021Y −40°C to 200 μV TLE2021AID TLE2021AIP to 85°C 200 μV 500 μV TLE2021AID TLE2021ID — — — TLE2021AIP TLE2021IP — — −55°C 100 V TLE2021BMFK TLE2021BMJG −55 C to 100 μV 500 μV — TLE2021MD — TLE2021BMFK TLE2021MFK TLE2021BMJG TLE2021MJG — TLE2021MP — — to 125°C 500 μV TLE2021MD TLE2021MFK TLE2021MJG TLE2021MP † The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR). ‡ The DB and PW packages are only available left-end taped and reeled. § Chip forms are tested at 25°C only. TLE2022 AVAILABLE OPTIONS PACKAGED DEVICES CHIP TA VIOmax AT 25°C SMALL OUTLINE† (D) SSOP‡ (DB) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP‡ (PW) CHIP FORM§ (Y) 0°C to 150 μV 300 μV TLE2022BCD TLE2022ACD — — TLE2022ACP — — to 70°C 300 μV 500 μV TLE2022ACD TLE2022CD — TLE2022CDBLE — — TLE2022ACP TLE2022CP — TLE2022CPWLE — TLE2022Y −40°C to 150 μV 300 μV TLE2022BID TLE2022AID — TLE2022AIP to 85°C 300 μV 500 μV TLE2022AID TLE2022ID — — — TLE2022AIP TLE2022IP — — −55°C 150 μV — — TLE2022BMJG — −55 C to 150 μV 300 μV — TLE2022AMD — — TLE2022AMFK TLE2022BMJG TLE2022AMJG — TLE2022AMP — — to 125°C 300 μV 500 μV TLE2022AMD TLE2022MD TLE2022AMFK TLE2022MFK TLE2022AMJG TLE2022MJG TLE2022AMP TLE2022MP † The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2022CDR). ‡ The DB and PW packages are only available left-end taped and reeled. § Chip forms are tested at 25°C only. TLE2024 AVAILABLE OPTIONS PACKAGED DEVICES CHIP TA VIOmax AT 25°C SMALL OUTLINE (DW) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) CHIP FORM§ (Y) 500 μV TLE2024BCDW TLE2024BCN — 0°C to 70 °C 500 μV 750 μV TLE2024BCDW TLE2024ACDW — — TLE2024BCN TLE2024ACN — — 0 C to 70 C 750 μV 1000 μV TLE2024ACDW TLE2024CDW TLE2024ACN TLE2024CN TLE2024Y 500 μV TLE2024BIDW TLE2024BIN −40°C to 85°C 500 μV 750 μV TLE2024BIDW TLE2024AIDW — — TLE2024BIN TLE2024AIN — 40 C to 85 C 750 μV 1000 μV TLE2024AIDW TLE2024IDW TLE2024AIN TLE2024IN 500 μV TLE2024BMDW TLE2024BMFK TLE2024BMJ TLE2024BMN −55°C to 125°C 500 μV 750 μV TLE2024BMDW TLE2024AMDW TLE2024BMFK TLE2024AMFK TLE2024BMJ TLE2024AMJ TLE2024BMN TLE2024AMN — 55 C to 125 C 750 μV 1000 μV TLE2024AMDW TLE2024MDW TLE2024AMFK TLE2024MFK TLE2024AMJ TLE2024MJ TLE2024AMN TLE2024MN § Chip forms are tested at 25°C only. |
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