4

TLV741P

SBVS309 – JULY 2017

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6 Specifications

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

Voltage

–0.3

6

V

–0.3

–0.3

3.6

Current

Internally limited

Output short-circuit duration

Indefinite

Total power dissipation

See Thermal Information

Temperature

–55

125

°C

–55

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±500

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

1.4

5.5

V

Enable range

0

V

Output current

0

150

mA

Input capacitor

0

1

µF

Output capacitor

1

100

µF

Operating junction temperature range

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

TLV741P

UNIT

DBV (SOT-23)

5 PINS

Junction-to-ambient thermal resistance

249

°C/W

Junction-to-case (top) thermal resistance

172.7

°C/W

Junction-to-board thermal resistance

76.7

°C/W

Junction-to-top characterization parameter

49.7

°C/W

Junction-to-board characterization parameter

75.8

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W