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BRD5N50 Datasheet(PDF) 6 Page - Foshan Blue Rocket Electronics Co.,Ltd. |
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BRD5N50 Datasheet(HTML) 6 Page - Foshan Blue Rocket Electronics Co.,Ltd. |
6 / 6 page BRD5N50 Rev.D May.-2016 DATA SHEET http://www.fsbrec.com 6 / 6 回流焊温度曲线图(无铅)/ Temperature Profile for IR Reflow Soldering(Pb-Free) 说明: Note: 1 、预热温度 25~150℃,时间 60~90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 2 、峰值温度 245±5℃,时间持续为 5±0.5sec; 2.Peak Temp.:245 ±5℃, Duration:5±0.5sec. 3 、焊接制程冷却速度为 2~10℃/sec. 3. Cooling Speed: 2~10 ℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度:260±5℃ 时间:10±1 sec. Temp.:260±5℃ Time:10±1 sec 包装规格 / Packaging SPEC. 卷盘包装 / REEL Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit:mm3) Units/Reel 只 /卷盘 Reels/Inner Box 卷盘 /盒 Units/Inner Box 只 /盒 Inner Boxes/Outer Box 盒 /箱 Units/Outer Box 只 /箱 Reel Inner Box 盒 Outer Box 箱 TO-252 2,500 2 5,000 5 25,000 13〞×16 360×360×50 385×257×392 套管包装 /TUBE Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit:mm3) Units/Tube 只 /套管 Tubes/Inner Box 套管 /盒 Units/Inner Box 只 /盒 Inner Boxes/Outer Box 盒 /箱 Units/Outer Box 只 /箱 Tube 套管 Inner Box 盒 Outer Box 箱 TO-251/252 75 48 3,600 5 18,000 526×20.5×5.25 555×164×50 575×290×180 使用说明 / Notices |
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