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SN74AUC1G07 Datasheet(PDF) 1 Page - Texas Instruments

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Part No. SN74AUC1G07
Description  SINGLE BUFFER /DRIVER WITH OPEN - DRAIN OUTPUT
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

SN74AUC1G07 Datasheet(HTML) 1 Page - Texas Instruments

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SN74AUC1G07
SINGLE BUFFER/DRIVER
WITH OPENDRAIN OUTPUT
SCES373L− SEPTEMBER 2001 − REVISED NOVEMBER 2003
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Available in the Texas Instruments
NanoStar
 and NanoFree Packages
D Optimized for 1.8-V Operation and Is 3.6-V
I/O Tolerant to Support Mixed-Mode Signal
Operation
D Ioff Supports Partial-Power-Down Mode
Operation
D Sub 1-V Operable
D Max tpd of 2.5 ns at 1.8 V
D Low Power Consumption, 10-µA Max ICC
D ±8-mA Output Drive at 1.8 V
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
This single buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V
VCC operation.
The output of the SN74AUC1G07 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions.
NanoStar
 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar
 − WCSP (DSBGA)
0.17-mm Small Bump − YEA
SN74AUC1G07YEAR
NanoFree
 − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
Tape and reel
SN74AUC1G07YZAR
_ _ _UV_
−40
°C to 85°C
NanoStar
 − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Tape and reel
SN74AUC1G07YEPR
_ _ _UV_
NanoFree
 − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
SN74AUC1G07YZPR
SOT (SOT-23) − DBV
Tape and reel
SN74AUC1G07DBVR
U07_
SOT (SC-70) − DCK
Tape and reel
SN74AUC1G07DCKR
UV_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
Copyright
 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
5
4
NC
A
GND
VCC
Y
DNU − Do not use
3
2
1
4
5
GND
A
DNU
Y
VCC
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
NC − No internal connection
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
NanoStar and NanoFree are trademarks of Texas Instruments.


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