NCP380, NCV380

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Table 2. MAXIMUM RATINGS

Rating

Symbol

Value

Unit

From IN to OUT Pins: Input/Output (Note 1)

−7.0 to +7.0

V

IN, OUT, EN, ILIM, FLAG, Pins: Input/Output (Note 1)

−0.3 to +7.0

V

FLAG Sink Current

1

mA

1

mA

ESD Withstand Voltage (IEC 61000−4−2)

(Output Only

, when Bypassed with 1.0 mF Capacitor Minimum)

ESD IEC

15 Air, 8 Contact

kV

Human Body Model (HBM) ESD Rating (Note 2)

ESD HBM

2,000

V

Machine Model (MM) ESD Rating (Notes 2 and 3)

ESD MM

200

V

Latch-up Protection (Note 4)

Pins IN, OUT, EN, ILIM, FLAG

LU

100

mA

Maximum Junction Temperature Range (Note 6)

−40 to +TSD

°C

Storage Temperature Range

−40 to +150

°C

Moisture Sensitivity (Note 5)

MSL

Level 1

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. According to JEDEC standard JESD22−A108.

2. This device series contains ESD protection and passes the following tests:

Human Body Model (HBM)

±2.0 kV per JEDEC standard: JESD22−A114 for all pins.

Machine Model (MM)

±200 V per JEDEC standard: JESD22−A115 for all pins.

3. Except EN pin, 150 V.

4. Latch up Current Maximum Rating:

±100 mA per JEDEC standard: JESD78 class II.

5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.

6. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.

Table 3. OPERATING CONDITIONS

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Operational Power Supply

2.5

−

5.5

V

Enable Voltage

0

−

5.5

Ambient Temperature Range

−40

25

+85

°C

Junction Temperature Range

−40

25

+125

°C

Resistor from ILIM to GND Pin

5.0

−

250

k

W

FLAG Sink Current

−

−

1.0

mA

Decoupling Input Capacitor

1.0

−

−

mF

Decoupling Output Capacitor

USB Port per Hub

120

−

−

mF

Thermal Resistance Junction-to-Air

UDFN−6 Package (Notes 7 and 8)

−

120

−

°C/W

TSOP−5 Package (Notes 7 and 8)

−

305

−

°C/W

TSOP−6 Package (Notes 7 and 8)

−

280

−

°C/W

Maximum DC Current

UDFN−6 Package

−

−

2.1

A

TSOP−5, TSOP−6 Package

−

−

1.0

A

Power Dissipation Rating (Note 9)

UDFN−6 Package

−

830

−

mW

TSOP−5 Package

−

325

−

mW

TSOP−6 Package

−

350

−

mW

UDFN−6 Package

−

325

−

mW

TSOP−5 Package

−

130

−

mW

TSOP−6 Package

−

145

−

mW

7. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.

with 2-once copper traces on top and bottom of the board. Exposed pad is connected to ground plane for UDFN−6 version only.

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