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COP8TAB9CLQ8 Datasheet(PDF) 2 Page - National Semiconductor (TI) |
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COP8TAB9CLQ8 Datasheet(HTML) 2 Page - National Semiconductor (TI) |
2 / 59 page 3.0 Block Diagram 20047501 4.0 Ordering Information Part Numbering Scheme COP8 TA C 9 H LQ 8 Family and Feature Set Indicator Program Memory Size Program Memory Type No. Of Pins Package Type Temperature B=2k C=4k 5 = Masked ROM 9 = Flash C=20Pin E=28Pin H=44Pin LQ = LLP MW = SOIC WIDE 8 = -40 to +85˚C Note: The user, utilizing the COP8TAx9 Flash based devices during devel- opment for applications to be produced using the COP8TAx5 ROM devices, is cautioned to ensure that code contains NO calls to Boot ROM functions prior to submission for ROM generation. Instances of the JSRB instruction in ROM based devices will be executed as a JSR instruction to a location in the first 256 bytes of Program Memory. Flash and ROM devices are not 100% identical. The execution of the JSRB instruction is an example of the potential differences between the devices. For this reason, the user is strongly advised to obtain a masked ROM prototype devices before committing to production quantities. This will allow the user to ensure there are no unexpected differences between Flash an ROM devices within the application. www.national.com 2 |
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