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EL7554 Datasheet(PDF) 7 Page - Intersil Corporation |
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EL7554 Datasheet(HTML) 7 Page - Intersil Corporation |
7 / 14 page 7 FN7360.2 January 31, 2005 FIGURE 7. FS vs IO FIGURE 8. LOAD REGULATIONS FIGURE 9. HTSSOP THERMAL RESISTANCE vs PCB AREA (NO AIR FLOW) FIGURE 10. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Typical Performance Curves (Continued) VIN = VD = 3.3V, VO = 1.8V, IO = 4A, L = 2.2µH, CIN = 2x10µF, COUT = 47µF, COSC = 220pF, TA = 25°C unless otherwise noted. 610 590 585 01.5 2.5 4 IO (A) 595 0.5 2 3.5 600 605 1 3 VIN=5V VIN=3.3V 0.8 -0.2 -0.4 04 IO (A) 0.6 0.2 12 3 0.4 0.0 50 45 40 35 30 25 123 456 789 PCB AREA (in2) CONDITION: 28-Pin HTSSOP THERMAL PAD SOLDERED TO 2-LAYER PCB WITH 0.039" THICKNESS AND 1 OZ. COPPER ON BOTH SIDES JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD HTSSOP EXPOSED DIEPAD NOT SOLDERED TO PCB 1.2 1 0.8 0.4 0.2 0 0 25 50 75 100 150 AMBIENT TEMPERATURE (°C) 1.136W 125 85 0.6 θ JA = 110 °C /W HT SS OP 28 4.5 4 3.5 2 1.5 0.5 0 0 25 50 75 100 150 AMBIENT TEMPERATURE (°C) 4.167W 125 85 2.5 1 3 θ JA = 30° C/W HTS SO P2 8 JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD HTSSOP EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5 EL7554 |
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