4

THS3491

SBOS875 – AUGUST 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Stay below this dV/dT supply turn on and off edge rate to make sure that the edge-triggered ESD absorption device across the supply

pins remains open. Exceeding this supply edge rate may transiently show a short circuit across the supplies.

(3)

Long-term continuous current for electro-migration limits.

(4)

Thermal shutdown at approximately 165°C junction temperature and recovery at approximately 145°C

(5)

See the MSL/Reflow Rating information provided with the material, or see the TI web site at www.ti.com for the latest information.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Voltage

33

V

1

V/µs

Input/output voltage range

V

Differential input voltage

±0.5

Current

±10

mA

±100

Temperature

TBD

TBD

°C

(4)

Normal operation

150

Continuous operation, long-term reliability

125

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±1000

V

±500

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Dual supply

±7

±15

±16

V

Single supply

14

30

32

Operating free-air temperature

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THS3491

UNIT

DDA

(SO PowerPAD™)

RGT

(VQFN With

Thermal Pad)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

44.5

49.6

°C/W

Junction-to-case (top) thermal resistance

66.8

55.4

°C/W

Junction-to-board thermal resistance

19.2

23.1

°C/W

Junction-to-top characterization parameter

6.4

1.8

°C/W

Junction-to-board characterization parameter

19.5

23.2

°C/W

Junction-to-case (bottom) thermal resistance

7.5

7.8

°C/W