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SN74AUP1G125YZTR Datasheet(PDF) 5 Page - Texas Instruments |
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SN74AUP1G125YZTR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 46 page 5 SN74AUP1G125 www.ti.com SCES595N – JULY 2004 – REVISED JULY 2017 Product Folder Links: SN74AUP1G125 Submit Documentation Feedback Copyright © 2004–2017, Texas Instruments Incorporated (1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report, Implications of Slow of Floating CMOS Inputs, SCBA004. 6.3 Recommended Operating Conditions See (1) MIN MAX UNIT VCC Supply voltage 0.8 3.6 V VIH High-level input voltage VCC = 0.8 V VCC 3.6 V VCC = 1.1 V to 1.95 V 0.65 × VCC 3.6 VCC = 2.3 V to 2.7 V 1.6 3.6 VCC = 3 V to 3.6 V 2 3.6 VIL Low-level input voltage VCC = 0.8 V 0 V VCC = 1.1 V to 1.95 V 0 0.35 × VCC VCC = 2.3 V to 2.7 V 0 0.7 VCC = 3 V to 3.6 V 0 0.9 VO Output voltage Active state 0 VCC V 3-state 0 3.6 IOH High-level output current VCC = 0.8 V –20 µA VCC = 1.1 V –1.1 mA VCC = 1.4 V –1.7 VCC = 1.65 V –1.9 VCC = 2.3 V –3.1 VCC = 3 V –4 IOL Low-level output current VCC = 0.8 V 20 µA VCC = 1.1 V 1.1 mA VCC = 1.4 V 1.7 VCC = 1.65 V 1.9 VCC = 2.3 V 3.1 VCC = 3 V 4 Δt/Δv Input transition rise or fall rate VCC = 0.8 V to 3.6 V 200 ns/V TA Operating free-air temperature –40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) SN74AUP1G125 UNIT DCK (SC70) DBV (SOT-23) DRL (SOT) DRY (SON) DSF (SON) YFP (DSBGA) YZP (DSBGA) DPW (X2SON) 5 PINS 5 PINS 5 PINS 6 PINS 6 PINS 6 PINS 5 PINS 5 PINS RθJA Junction-to- ambient thermal resistance 303.6 230.5 295.1 342.1 377.1 125.4 146.2 504.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 203.8 172.7 131.0 233.1 187.7 1.9 1.4 234.9 °C/W RθJB Junction-to-board thermal resistance 100.9 62.2 143.9 206.7 236.6 37.2 39.3 370.3 °C/W ψθJt Junction-to-top characterization parameter 76.1 49.3 14.7 63.4 29.0 0.5 0.7 44.5 °C/W ψθJB Junction-to-board characterization parameter 99.3 61.6 144.4 206.7 236.3 37.5 39.8 369.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A N/A N/A 165.2 °C/W |
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