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TPS22916 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS22916 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 29 page 4 TPS22916 SLVSDO5A – JULY 2017 – REVISED SEPTEMBER 2017 www.ti.com Product Folder Links: TPS22916 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN Input voltage –0.3 6 V VOUT Output voltage –0.3 6 V VON Enable voltage –0.3 6 V IMAX Maximum continuous switch current 2 A IPLS Maximum pulsed switch current, pulse < 300-µs, 2% duty cycle 2.5 A TJ,MAX Maximum junction temperature 125 °C TSTG Storage temperature –65 150 °C TLEAD Maximum Lead temperature (10-s soldering time) 300 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±500 V may actually have higher performance. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±500 6.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Input voltage 1 5.5 V VOUT Output voltage 0 5.5 V VIH High-level input voltage, ON 1 5.5 V VIL Low-level input voltage, ON 0 0.35 V TA Operating free-air temperature –40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information Thermal Parameters(1) TPS22916xx UNIT YFP (WCSP) 4 PINS θJA Junction-to-ambient thermal resistance 193 °C/W θJCtop Junction-to-case (top) thermal resistance 2.3 °C/W θJB Junction-to-board thermal resistance 36 °C/W ψJT Junction-to-top characterization parameter 12 °C/W ψJB Junction-to-board characterization parameter 36 °C/W |
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