4

TPS22916

SLVSDO5A – JULY 2017 – REVISED SEPTEMBER 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

–0.3

6

V

Output voltage

–0.3

6

V

Enable voltage

–0.3

6

V

Maximum continuous switch current

2

A

Maximum pulsed switch current, pulse < 300-µs, 2% duty cycle

2.5

A

Maximum junction temperature

125

°C

Storage temperature

–65

150

°C

Maximum Lead temperature (10-s soldering time)

300

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions. Pins listed as ±500 V may actually have higher performance.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage

1

5.5

V

Output voltage

0

5.5

V

High-level input voltage, ON

1

5.5

V

Low-level input voltage, ON

0

0.35

V

Operating free-air temperature

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

TPS22916xx

UNIT

YFP (WCSP)

4 PINS

Junction-to-ambient thermal resistance

193

°C/W

Junction-to-case (top) thermal resistance

2.3

°C/W

Junction-to-board thermal resistance

36

°C/W

Junction-to-top characterization parameter

12

°C/W

Junction-to-board characterization parameter

36

°C/W