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APC207BI-TR Datasheet(PDF) 10 Page - List of Unclassifed Manufacturers

Part # APC207BI-TR
Description  Rail to Rail Output CMOS Single Operating Amplifier
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Manufacturer  ETC [List of Unclassifed Manufacturers]
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APC207BI-TR Datasheet(HTML) 10 Page - List of Unclassifed Manufacturers

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Copyright
 ANPEC Electronics Corp.
Rev. A.1 - Nov., 2001
APC207/208
www.anpec.com.tw
10
Reference JEDEC Standard J-STD-020A APRIL 1999
Reflow Condition (IR/Convection or VPR Reflow)
Physical Specifications
Terminal Material
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb
Lead Solderability
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Packaging
2500 devices per reel
Pre-heat temperature
183 C
Peak temperature
Time
°
Classification Reflow Profiles
Convection or IR/
Convection
VPR
Average ramp-up rate(183°C to Peak)
3°C/second max.
10 °C /second max.
Preheat temperature 125 ± 25°C)
120 seconds max
Temperature maintained above 183°C
60 – 150 seconds
Time within 5°C of actual peak temperature 10 –20 seconds
60 seconds
Peak temperature range
220 +5/-0°C or 235 +5/-0°C 215-219°C or 235 +5/-0°C
Ramp-down rate
6 °C /second max.
10 °C /second max.
Time 25°C to peak temperature
6 minutes max.
Package Reflow Conditions
pkg. thickness ≥≥≥≥ 2.5mm
and all bgas
pkg. thickness < 2.5mm and
pkg. volume ≥≥≥≥ 350 mm³
pkg. thickness < 2.5mm and pkg.
volume < 350mm³
Convection 220 +5/-0 °C
Convection 235 +5/-0 °C
VPR 215-219 °C
VPR 235 +5/-0 °C
IR/Convection 220 +5/-0 °C
IR/Convection 235 +5/-0 °C


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