1/5

www.asb.co.kr

September 2017

Low Noise & High OIP3

Medium Power Amplifier Module

Parameter

Unit

Specifications

Min

Typ

Max

Frequency Range

MHz

698

787

Gain

dB

49

50

Gain Flatness

dB

 0.6

 0.7

Noise Figure

dB

1.0

1.1

dBm

44

47

dB

-14 / -14

Output P1dB

dBm

28

29

sec

-

Supply Current

mA

460

500

Supply Voltage

V

5

Impedance



50

Package Type & Size

mm

Surface Mount Type, 13Wx13Lx3.8H

Operating temperature is -40

C to +85C.

1) OIP3 is measured with two tones at an output power of 12 dBm / tone separated by 1 MHz.

2) S11/S22 (max) is the worst value within the frequency band.

Pin Number

Function

3

RF In

8

RF Out

10

Vs

Others

Ground

Features

Note: 1. The number and size of ground via holes in

a circuit board is critical for thermal RF

grounding considerations.

2. We recommend that the ground via holes be

placed on the bottom of all ground pins for

better RF and thermal performance, as

shown in the drawing at the left side.

Description

APM0743-P29

ASB Inc.

Solder Stencil Area

Ø

0.3 plated thru holes to ground plane

plerow

·

= 49.4 dB @ 787 MHz

·

NF of 1.0 dB over Frequency

·

Unconditionally Stable

·

Single 5V Supply

·

High OIP3 @ Low Current

Website: www.asb.co.kr

E-mail: sales@asb.co.kr

Tel: (82) 42-528-7223

Fax: (82) 42-528-7222

More Information

2-stage Single Type

(Top View)

(Bottom View)

(Side View)

2 x Ø 2.0 plated thru holes to screw on heat sinker

(Recommended Footprint)

Outline Drawing (Unit: mm)

Typ. @ T = 25

Specifications (in Production)

amplifier mini-module for such application band in

SMD package with the output P1dB of 29 dBm. It is

compactly designed for low current consumption and

high OIP3. Integrating all the components for biasing

and matching within the module enhances production

yield and throughput as well. It passes through the

stringent DC, RF, and reliability tests. Not sample test

but 100% quality control test is made before packing.