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TCAN4550RGYQ1 Datasheet(PDF) 5 Page - Texas Instruments |
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TCAN4550RGYQ1 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 7 page www.ti.com EXAMPLE BOARD LAYOUT 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND 20X (0.6) 20X (0.25) 14X (0.5) (2.2) (3.2) 4X (4.3) 4X (0.75) (1.35) (3.3) (0.85) (R0.05) TYP 2X (0.75) 4X (0.25) (4.2) ( 0.2) TYP VIA VQFN - 1 mm max height RGY0020C PLASTIC QUAD FLATPACK - NO LEAD 4223814/A 06/2017 SYMM 1 9 10 11 12 2 19 20 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:18X 21 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METAL SOLDER MASK OPENING NON SOLDER MASK SOLDER MASK DETAILS DEFINED (PREFERRED) EXPOSED METAL 5 TCAN4550-Q1 www.ti.com SLLSF56 – OCTOBER 2017 Product Folder Links: TCAN4550-Q1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated |
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