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TLV70218QDSERQ1 Datasheet(PDF) 2 Page - Texas Instruments |
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TLV70218QDSERQ1 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 25 page TLV702-Q1 SLVSC35B – AUGUST 2013 – REVISED JUNE 2015 www.ti.com Table of Contents 1 Features .................................................................. 1 8 Application and Implementation ........................ 12 8.1 Application Information............................................ 12 2 Applications ........................................................... 1 8.2 Typical Application .................................................. 12 3 Description ............................................................. 1 9 Power Supply Recommendations ...................... 14 4 Revision History..................................................... 2 9.1 Power Dissipation ................................................... 14 5 Pin Configuration and Functions ......................... 3 10 Layout................................................................... 14 6 Specifications......................................................... 4 10.1 Layout Guidelines ................................................. 14 6.1 Absolute Maximum Ratings ...................................... 4 10.2 Layout Examples................................................... 15 6.2 ESD Ratings.............................................................. 4 11 Device and Documentation Support ................. 16 6.3 Recommended Operating Conditions ....................... 4 11.1 Device Support .................................................... 16 6.4 Thermal Information .................................................. 4 11.2 Documentation Support ........................................ 16 6.5 Electrical Characteristics........................................... 5 11.3 Community Resources.......................................... 16 6.6 Typical Characteristics .............................................. 6 11.4 Trademarks ........................................................... 16 7 Detailed Description ............................................ 10 11.5 Electrostatic Discharge Caution ............................ 16 7.1 Overview ................................................................. 10 11.6 Glossary ................................................................ 16 7.2 Functional Block Diagrams ..................................... 10 12 Mechanical, Packaging, and Orderable 7.3 Feature Description................................................. 10 Information ........................................................... 17 7.4 Device Functional Modes........................................ 11 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (August 2013) to Revision B Page • Added DSE (6-Pin WSON) package to data sheet ................................................................................................................ 1 • Added Device Information, ESD Ratings, and Recommended Operating Conditions tables, and Detailed Description, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections to data sheet .................................................... 1 • Deleted all references to P version of device throughout data sheet..................................................................................... 1 • Added "Over Temperature" to 2% accuracy Features bullet ................................................................................................ 1 • Changed DDC package name from TSOT23 to SOT throughout data sheet ........................................................................ 1 • Changed Applications bullets ................................................................................................................................................. 1 • Changed Description section text........................................................................................................................................... 1 • Changed ceramic capacitor units on Typical Application circuit from mF to µF (typo) ......................................................... 1 • Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement .................... 4 • Added TJ to TA condition in Electrical Characteristics condition statement............................................................................ 5 • Changed TA to TJ for typical values in Electrcial Characteristics condition statement ........................................................... 5 2 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TLV702-Q1 |
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