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TDA8947J Datasheet(PDF) 18 Page - NXP Semiconductors

Part # TDA8947J
Description  4-channel audio amplifier (SE: 1 W to 25 W; BTL: 4 W to 50 W)
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDA8947J Datasheet(HTML) 18 Page - NXP Semiconductors

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Philips Semiconductors
TDA8947J
4-channel audio amplifier
Preliminary data
Rev. 01 — 06 February 2004
18 of 24
9397 750 10779
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
13.3 Thermal behavior and heatsink calculation
The measured maximum thermal resistance of the IC package, Rth(j-mb), is 1.3 K/W.
A calculation for the heatsink can be made, with the following parameters:
Tamb(max) =60 °C (example)
VCC = 18 V and RL =4 Ω (SE)
Tj(max) = 150 °C (specification)
Rth(tot) is the total thermal resistance between the junction and the ambient including
the heatsink. This can be calculated using the maximum temperature increase
divided by the power dissipation:
Rth(tot) =(Tj(max) − Tamb(max))/PD
At VCC =18V and RL =4 Ω (4 × SE) the measured worst-case sine-wave dissipation
is 17 W; see Figure 9. For Tj(max) = 150 °C the temperature raise, caused by the
power dissipation, is: 150
− 60=90 °C:
P
× R
th(tot) =90 °C
Rth(tot) = 90/17 = 5.29 K/W
Rth(h-a) =Rth(tot) − Rth(j-mb) = 5.29 − 1.3 = 3.99 K/W
This calculation is for an application at worst-case (stereo) sine-wave output signals.
In practice music signals will be applied, which decreases the maximum power
dissipation to approximately half of the sine-wave power dissipation of 9 W (see
Section 8.2.2). This allows for the use of a smaller heatsink:
P
× R
th(tot) =90 °C
Rth(tot) = 90/9 = 10 K/W
Rth(h-a) =Rth(tot) − Rth(j-mb) =10 − 1.3 = 8.7 K/W


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