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ADG902BCP-REEL7 Datasheet(PDF) 9 Page - Analog Devices |
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ADG902BCP-REEL7 Datasheet(HTML) 9 Page - Analog Devices |
9 / 12 page REV. A ADG901/ADG902 –9– APPLICATIONS The ADG901/ADG902 are ideal solutions for low power, high frequency applications. The low insertion loss, high isolation between ports, low distortion, and low current consumption of these parts make them excellent solutions for many high frequency switching applications. Applications include switching between high frequency filters, ASK generator, and FSK generator. Absorptive vs. Reflective Switches The ADG901 is an absorptive (matched) switch with 50 Ω termi- nated shunt legs, and the ADG902 is a reflective switch with 0 Ω terminated shunts to ground. The ADG901 absorptive switch has a good VSWR on each port, regardless of the switch mode. An absorptive switch should be used when there is a need for a good VSWR that is looking into the port but not passing the through signal to the common port. The ADG901 is therefore ideal for applications that require minimum reflections back to the RF source. It also ensures that the maximum power is trans- ferred to the load. The ADG902 reflective switch is suitable for applications where high off port VSWR does not matter and the switch has some other desired performance feature. It can be used in many appli- cations, including high speed filter selection. In most cases, an absorptive switch can be used instead of a reflective switch, but not vice versa. ADG9xx EVALUATION BOARD The ADG9xx evaluation board allows designers to evaluate the high performance wideband switches with a minimum of effort. To prove that these devices meet user requirements, the user requires only a power supply and a network analyzer along with the evaluation board. An application note is available with the evaluation board and provides complete information on operating the evaluation board. The RF1 port (see Figure 3) is connected through a 50 Ω trans- mission line to the top left SMA connector J1. RF2 is connected through a 50 Ω transmission line to the top SMA connector J2. J3 is connected to GND. A through transmission line connects J4 and J5 and this transmission line is used to estimate the loss of the PCB over the environmental conditions being evaluated. The board is constructed of a 4-layer, FR4 material with a dielec- tric constant of 4.3 and an overall thickness of 0.062 inches. Two ground layers with grounded planes provide ground for the RF transmission lines. The transmission lines were designed using a coplanar waveguide with ground plane model using a trace width of 0.052 inches, clearance to ground plane of 0.030 inches, dielectric thickness of 0.029 inches, and a metal thickness of 0.014 inches. Figure 3. ADG9xx Evaluation Board Top View |
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