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TFDU4300-TT1 Datasheet(PDF) 8 Page - Vishay Siliconix

Part # TFDU4300-TT1
Description  Infrared Transceiver Module (SIR, 115.2 kbit/s)
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

TFDU4300-TT1 Datasheet(HTML) 8 Page - Vishay Siliconix

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Document Number 82614
Rev. 1.4, 26-Jan-04
VISHAY
TFDU4300
Vishay Semiconductors
Recommended Circuit Diagram
Operated with a clean low impedance power supply
the TFDU4300 needs no additional external compo-
nents. However, depending on the entire system
design and board layout, additional components may
be required (see figure 1).
Recommended Application Circuit
The capacitor C1 is buffering the supply voltage and
eliminates the inductance of the power supply line.
This one should be a Tantalum or other fast capacitor
to guarantee the fast rise time of the IRED current.
The resistor R1 is the current limiting resistor, which
may be used to reduce the operating current to levels
below the specified controlled values for saving bat-
tery power.
Vishay’s transceivers integrate a sensitive receiver
and a built-in power driver. The combination of both
needs a careful circuit board layout. The use of thin,
long, resistive and inductive wiring should be avoided.
The inputs (Txd, SD) and the output Rxd should be
directly connected (DC - coupled) to the I/O circuit.
The capacitor C2 combined with the resistor R2 is the
low pass filter for smoothing the supply voltage. R2,
C1 and C2 are optional and dependent on the quality
of the supply voltages VCC1 and injected noise. An
unstable power supply with dropping voltage during
transmission may reduce the sensitivity (and trans-
mission range) of the transceiver.
The placement of these parts is critical. It is strongly
recommended to position C2 as close as possible to
the transceiver power supply pins. An Tantalum
capacitor should be used for C1 while a ceramic
capacitor is used for C2.
In addition, when connecting the described circuit to
the power supply, low impedance wiring should be
used.
When extended wiring is used the inductance of the
power supply can cause dynamically a voltage drop
at VCC2. Often some power supplies are not apply to
follow the fast current rise time. In that case another
4.7
µF (type, see table under C1) at VCC2 will be help-
ful.
Under extreme EMI conditions as placing an RF-
transmitter antenna on top of the transceiver, we rec-
ommend to protect all inputs by a low-pass filter, as a
minimum a 12 pF capacitor, especially at the Rxd
port. The transceiver itself withstands EMI at GSM
frequencies above 300 V/m. When interference is
observed, it is picked up by the wiring to the inputs. It
is verified by DPI (direct power injection) measure-
ments that as long as the interfering RF - voltage is
below the logic threshold levels of the inputs and
equivalent levels at the outputs no interference is
expected.
Figure 2 and figure 3 show examples for circuit dia-
grams to work with low voltage logic and using the
transceiver when VCC1 = Vlogic, just connecting the
responsible pins to each other.
Figure 1. Recommended Application Circuit
IRED Anode
Vcc
Ground
SD
Txd
Rxd
VCC1
GND
SD
Txd
Rxd
R1
R2
C1
C2
18096
Vlogic
Mode
VCC 2
IRED Cathode


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